WMSIC Electronic Components

Jingdao Microelectronics ES5JC

ModelES5JC
PackageSMC
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic ES5JC
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
ES5JC
Electronic Component
1
Package
SMC
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.381g
Electronic Component
1
Electronic Component
BM0230856397
Current
5A
Diode
1
Current(Ir)
5uA@600V
(Vf)
1.68V@5A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ES5JC 产品概述 — 晶导微电子 快恢复/高效率二极管

一、产品简介

ES5JC为晶导微电子推出的独立式快恢复整流二极管,SMC封装,额定整流电流5A,直流反向耐压600V,专为中高压开关电源、电机驱动及整流应用设计。器件兼顾低正向压降与快速反向恢复,适合在高频开关环境中实现更高效率和更小热损耗。

二、主要性能参数

  • 二极管配置:独立式(Discrete)
  • 工作结温范围:-55℃ ~ +150℃(Tj)
  • 标称整流电流:5A(DC)
  • 正向压降:Vf = 1.68V @ 5A
  • 非重复峰值浪涌电流(Ifsm):120A
  • 直流反向耐压:Vr = 600V
  • 反向电流:Ir = 5 μA @ 600V
  • 反向恢复时间:Trr = 35 ns
  • 封装:SMC

三、主要特性与优势

  1. 低导通损耗:1.68V@5A 的正向压降在整流工作点提供较低的导通损耗,降低发热,有利于提高系统效率。
  2. 快恢复特性:35ns 的反向恢复时间有效减少开关期间的能量回收和电磁干扰,对高频开关电源尤为重要。
  3. 高电压能力与低泄漏:600V 阻断电压配合仅 5μA 的反向电流,保证高电压侧良好的阻断性能与低待机损耗。
  4. 抗浪涌能力:120A 的非重复峰值浪涌能力能承受短时的启动或负载突变冲击,提高系统可靠性。
  5. SMC 封装:体积适中且易于散热,适合在标准SMT工艺中实现良好热管理。

四、典型应用场景

  • 开关电源(SMPS)输出整流与回收回路
  • 电机驱动(电流回路/再生回路)
  • 逆变器、太阳能并网微逆/串联整流
  • UPS、LED驱动电源及工业电源的高压整流
  • 极限环境下的保护二极管与极性防护

五、封装与热管理建议

SMC封装便于在PCB上通过加大铜箔面积来提升散热能力。实际使用时建议:

  • 在电流路径处增加热源散热铜箔并使用热通孔(vias)将热量传导至底层散热层。
  • 对于长期5A工作,应参照实际PCB温升测试确定所需铜箔面积与散热措施。
  • 焊接按行业回流规范进行,避免超温影响器件性能与寿命。

六、使用注意事项

  • 避免长期在极限结温下工作,建议留有温升余量以提高可靠性。
  • 在高速开关场合,配合适当的RC缓冲或吸收网络可抑制反向恢复带来的尖峰电压。
  • 浪涌电流Ifsm为短时非重复能力,非设计为连续冲击使用。
  • 建议在设计阶段做实际系统级热仿真与浪涌测试以确认性能满足需求。

ES5JC以其低压降、快恢复与高电压承受能力,适合需要兼顾效率与可靠性的中高压整流与开关场景。若需数据手册或封装/焊盘建议图,可联系晶导微电子获取详细资料。

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