Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Jingdao Microelectronics 1SMA4736A
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic 1SMA4736A
- Type
- Jingdao Microelectronics
- Minimum package
- 5000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- 1SMA4736A
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- Zener Diode
- Electronic Component
- 0.12g
- Electronic Component
- 1
- (Zzt)
- 3.5Ω
- Electronic Component
- BM0231086967
- Diode
- 1
- Current(Ir)
- 10uA@4V
- Power Dissipation(Pd)
- 1W
- Electronic Component
- 6.46V~7.18V
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SMA4736A 产品概述
一、产品简介
1SMA4736A 是晶导微电子推出的一款独立式稳压二极管（Zener diode），标称稳压值为 6.8V。器件采用 SMA 封装，适用于表面贴装应用，提供稳压、过压保护和参考基准等功能。其紧凑外形和良好的热性能使之适合消费电子、通信设备和工业控制等多种场景。
二、主要特点
- 标称稳压值：6.8V，稳压值范围：6.46V ~ 7.18V。
- 反向电流 Ir：10μA @ VR = 4V（低漏电流，有利于节能与高阻抗参考）。
- 动态阻抗 Zzt：3.5Ω（在指定工作点低动态阻抗，稳压性能稳定）。
- 最大耗散功率 Pd：1W（在推荐散热条件下）。
- 工作结温范围：-55℃ ~ +150℃，适应广泛温度环境。
- SMA 表面贴装封装，便于自动化生产与可靠焊接。
三、电气性能与典型参数
器件在规定测试条件下的稳压精度和温度特性满足通用稳压需求。典型参数包括：6.8V 标称稳压；在低电流（4V 测试点）下漏电流约 10μA；动态阻抗约 3.5Ω，有助于在中小电流范围内保持较好的电压稳定性。1W 的耗散能力要求在 PCB 设计中注意热处理与铜箔面积以避免结温过高。
四、封装与热管理
SMA 封装尺寸小、热阻适中。为了确保长期可靠性和最大额定功率输出，建议在 PCB 设计中：
- 增加焊盘铜箔面积与热散路径；
- 在高功率或重复脉冲应用中进行功率降额设计；
- 遵循器件的回流焊工艺规范，避免超温超时。
五、典型应用场景
- 电源稳压与基准电压源；
- 过压保护与钳位电路；
- 通信终端、工业控制模块、便携设备的局部稳压；
- 任意需要中低电流稳压且受空间限制的应用。
六、使用注意事项
- 避免持续在接近 1W 的条件下长期工作，建议按环境温度对耗散功率进行降额；
- 在高温环境下关注结温，保证工作结温不超过 +150℃；
- 焊接时遵守封装热循环限制，避免因过热造成可靠性下降；
- 对静电敏感设备，装配与测试过程中注意防静电措施。
七、采购与质量
晶导微电子出品，SMA 封装，适合批量自动贴装生产。建议向正规渠道采购，并参考厂商提供的详细数据手册（含温度系数、脉冲特性和封装尺寸）以完成系统级设计与可靠性验证。
以上信息基于器件常见规格参数汇总，具体设计与选型请参照晶导微电子官方数据手册和样品测试结果。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
