WMSIC Electronic Components

Jingdao Microelectronics ES8JC

ModelES8JC
PackageSMC
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic ES8JC
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
ES8JC
Electronic Component
1
Package
SMC
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.381g
Electronic Component
1
Electronic Component
BM0227664055
Current
8A
Diode
1
Current(Ir)
10uA@600V
(Vf)
1.7V@8A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ES8JC 产品概述

一、产品简介

ES8JC 为晶导微电子推出的独立式快恢复、高效率整流二极管,封装为 SMC。器件工作结温范围为 -55℃ 至 +150℃,直流整流电流 8A,适合中功率开关电源与整流场景。

二、主要性能特点

  • 正向压降 Vf = 1.7V @ 8A,导通损耗低,有利于提高整机效率。
  • 非重复峰值浪涌电流 Ifsm = 125A,可承受启动或短时冲击电流。
  • 直流反向耐压 Vr = 600V,适用于高压整流与 PFC 电路。
  • 反向电流 Ir = 10µA @ 600V,低漏电有利于高压下的静态损耗控制。
  • 反向恢复时间 Trr = 35ns,属于快恢复类型,能减少开关损耗与关断应力。

三、电气与热设计要点

  • 在持续 8A 工作点应考虑结-壳、壳-环境的散热能力,建议在 PCB 设计中增大铜箔面积并确保良好散热路径。
  • 正向压降决定了导通损耗 P ≈ Vf×I,应在热预算中留出裕量并考虑器件随结温上升而增大的 Vf 与 Ir。
  • 对于有频繁开关或高 dv/dt 的场合,需关注反向恢复引起的电压尖峰与额外损耗,可配合缓冲元件(R-C、SBD 并联等)优化。

四、典型应用场景

  • 开关电源(SMPS)输出整流与次级整流。
  • 功率因数校正(PFC)桥式整流。
  • 逆变器、变频器的自由轮回与续流路径。
  • 工业电源、充电设备及其他中高压整流场合。

五、封装与安装注意事项

  • SMC 封装适合波峰/回流焊接,焊接时遵循焊料厂与工艺规范,避免长时间过高温度导致元件应力。
  • PCB 布局建议使电流回路尽量短且宽,减少寄生电感与热阻;器件冷却面应与散热铜皮良好接触。

六、可靠性与检验建议

  • 推荐在样机阶段进行温升测试、浪涌试验与反向恢复行为评估。
  • 量产导入时进行 100% 外观与焊接质量检查,关键应用可加入老化与热循环验证。

ES8JC 以其 600V/8A 的电压电流等级、快恢复特性与较低正向压降,适合要求效率与可靠性兼顾的功率整流应用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.