Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Jingdao Microelectronics MMBD4148CA
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic MMBD4148CA
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- MMBD4148CA
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Switch Diode
- Electronic Component
- 0.033g
- Electronic Component
- 1
- Electronic Component
- BM0227743086
- Current
- 200mA
- Current(Ir)
- 5uA@75V
- (Vf)
- 1V@10mA
- Power Dissipation(Pd)
- 350mW
- Electronic Component
- 55℃~+150℃@(Tj)
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMBD4148CA 产品概述
一、产品简介
MMBD4148CA 是晶导微电子推出的一款高速开关二极管，采用 SOT-23 小封装，针对高频信号开关、脉冲整流和小功率保护场合设计。器件在 10mA 工作点正向压降约 1.0V，反向耐压高达 100V，具有低反向漏电流与快速恢复特性，适用于消费电子、通信和工业控制等应用。
二、主要特性
- 正向压降（Vf）：1.0V @ If=10mA（典型）
- 直流反向耐压（Vr）：100V
- 直流整流电流：200mA
- 最大耗散功率（Pd）：350mW（封装与散热相关）
- 反向电流（Ir）：≤5μA @ Vr=75V
- 反向恢复时间（Trr）：4ns（快速开关）
- 工作结温范围：-55℃ ~ +150℃（Tj）
三、电气性能要点
器件在小信号和脉冲环境中表现优异。200mA 为器件允许的直流整流电流，但在实际电路中应考虑封装热阻与环境温度对功耗的限制以避免超温。低至几微安的反向漏流在高阻输入或电源保护场合能有效降低静态损耗。4ns 的反向恢复时间使其在高速开关和脉冲整流中切换损耗小、干扰低。
四、封装与热特性
SOT-23 细小封装利于高密度 PCB 布局。最大耗散功率 350mW 对应良好散热条件，若工作在高环境温度或长时间大电流工况下，应按器件热阻做功率去额定处理并考虑加大铜箔或散热通道。建议在 PCB 设计时优化焊盘和地/散热层布局以降低结到环境的热阻。
五、典型应用场景
- 高频信号开关、脉冲整流
- 逻辑电平隔离与钳位保护
- 输入保护、反接与过压抑制（低功率）
- 通信模块、传感器前端的小信号整流与开关
六、选型与使用建议
- 若长期工作于接近 200mA，需验证温升并实施散热措施；优先按功耗 Pd 和环境温度做热保额定。
- 高频开关场合注意走线最短、回流路径良好以降低寄生电感与振铃。
- 对极性与封装脚位在 PCB 布局中标注清晰，焊接工艺建议遵循 SOT-23 的回流曲线以保证可靠性。
七、可靠性与品质保障
晶导微电子提供工业级结温范围（-55℃~+150℃），并通过常规电气与热循环测试。建议在批量导入前完成可靠性验证（温度循环、湿热、振动与焊接热稳定性测试）以满足具体应用需求。
如需数据手册（完整电气特性曲线、典型特性图和封装尺寸），可向晶导微电子或授权分销渠道索取 MMBD4148CA 详细资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
