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Jingdao Microelectronics MSB50M
Configuration
1 options
Configuration
Option 131564
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic MSB50M
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- MSB50M
- Electronic Component
- 1
- Package
- UMSB
- Type
- Electronic Component
- Electronic Component
- Bridge Rectifier
- Electronic Component
- 0.37g
- Electronic Component
- 1
- Electronic Component
- BM0264858921
- Current
- 5A
- Current(Ir)
- 5uA@1000V
- (Vf)
- 1.1V@5A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MSB50M 单相整流桥产品概述
MSB50M是晶导微电子推出的一款中高压、中等电流单相整流桥，专为需要高效、可靠整流的场景设计。其参数覆盖了从常规家电到工业电源的核心需求，低导通损耗、高耐压余量与宽温适应性使其在多种应用中具备竞争力。
一、核心电气参数与性能优势
该器件的关键参数针对实际应用做了针对性优化，核心表现如下：
- 正向压降Vf：1.1V（@5A）—— 远低于普通整流桥的典型值（通常1.5V以上），导通损耗小，可有效降低工作温度，减少散热设计成本；
- 直流反向耐压Vr：1000V—— 提供充足的电压余量（如220V交流整流后峰值约311V，余量超2倍），适配市电及部分工业高压场景；
- 额定整流电流：5A（直流正向平均电流IF(AV)）—— 满足中等功率设备的连续工作需求；
- 反向漏电流Ir：5μA（@1000V）—— 漏电流极小，反向截止性能优异，可降低待机损耗与反向发热；
- 浪涌承受能力：非重复峰值浪涌电流Ifsm=150A—— 能抵御开机、负载突变等瞬间大电流冲击，提升系统可靠性；
- 宽温工作范围：-55℃~+150℃—— 适应低温（如户外、寒冷地区）与高温（如工业机箱内）环境，满足严苛工况需求。
二、封装与可靠性设计
MSB50M采用UMSB封装，该封装具备以下特点：
- 体积紧凑，适合小型化设备的功率密度需求；
- 散热路径优化，配合低Vf参数，可有效降低结温积累；
- 封装工艺成熟，引脚与内部芯片连接可靠，抗振动、抗冲击性能良好，适合批量生产与长期使用。
结合电气参数的冗余设计（如耐压、浪涌余量），该器件可在连续工作10万小时以上（符合功率器件行业可靠性标准）。
三、典型应用场景
基于参数匹配，MSB50M可广泛应用于以下场景：
- 工业开关电源：5A输出功率的小功率电源模块，适配1kV耐压与宽温需求；
- 家电设备：变频空调、洗衣机、电磁炉等的电源整流单元，抵御开机浪涌；
- 小型新能源系统：太阳能小功率逆变器、储能辅助电源的整流部分；
- 通信辅助电源：机房内小功率辅助模块，宽温适应机房环境变化。
四、品牌与品质保障
晶导微电子作为国内功率器件领域的主流厂商，其产品遵循国际与国内行业标准（如GB/T 15290相关整流桥规范），具备：
- 参数一致性好，批量应用时性能稳定；
- 完善的可靠性测试（高低温循环、浪涌冲击、振动测试等）；
- 本地化服务支持，便于技术对接与售后。
该器件凭借“高效、可靠、适配广”的特点，成为中功率整流场景的高性价比选择，可满足从消费电子到工业级应用的多元需求。
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