WMSIC Electronic Components

Jingdao Microelectronics RS3MF

ModelRS3MF
PackageSMAF
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic RS3MF
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
RS3MF
Electronic Component
1
Package
SMAF
Electronic Component
Fast Recovery / High-Efficiency Diode
Electronic Component
0.056g
Electronic Component
1
Electronic Component
BM0228061346
Current
3A
Diode
1
Current(Ir)
5uA@1kV
(Vf)
1.3V@3A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RS3MF 产品概述 — 晶导微电子

一、产品简介

RS3MF 是晶导微电子推出的一款独立式快恢复/高效率整流二极管,封装为 SMAF,额定整流电流 3A,重复峰值反向耐压 1000V。器件面向中高压开关电源、逆变器与工业电源等需要兼顾高耐压与快速恢复的应用场景,兼具较低正向压降与可观的抗浪涌能力。

二、主要电气参数

  • 正向压降 (Vf):1.3V @ If = 3A
  • 直流整流电流:3A(连续)
  • 非重复峰值浪涌电流 (Ifsm):80A
  • 直流反向耐压 (Vr):1000V
  • 反向电流 (Ir):5μA @ 1000V
  • 反向恢复时间 (Trr):500ns
  • 工作结温范围:-55℃ ~ +150℃ (Tj)
  • 封装:SMAF(独立式)

以上参数为典型/代表值,具体使用时请以正式数据手册为准。

三、产品特点

  • 高耐压设计:1000V 反向耐压适用于高电压整流与开关场合,提升系统可靠性。
  • 快恢复特性:约 500ns 的反向恢复时间,在中频率开关环境下可显著降低开关损耗与干扰。
  • 低正向压降:3A 工作点下 VF≈1.3V,有助于提高整机效率并减少发热。
  • 优良的浪涌能力:80A 非重复峰值浪涌电流满足启动或短时冲击电流要求。
  • 封装与安装:SMAF 封装便于手工焊接与自动化贴装,适合密度较高的电路板设计。

四、典型应用

  • 开关电源(SMPS)次级与主整流
  • 逆变器与电驱动系统的自由轮二极管
  • 电池充电器与适配器
  • 工业电源、通讯电源与整流模块
  • 需要高耐压且对效率有一定要求的高压整流场合

五、设计与使用建议

  • 热管理:虽然 VF 较低,但长期 3A 工作会产生热量,建议结合铜箔散热、大面积地线或散热垫使用,并按数据手册对结温进行降额处理。
  • 反向恢复注意事项:Trr ≈ 500ns 属于中等恢复速度,若在高 dv/dt 或高开关频率场景下使用,建议在二极管两端加 RC 缓冲或吸收网络,避免回路过压与 EMI。
  • 浪涌能力:Ifsm = 80A 为非重复潮流能力,设计时仍需避免频繁超过额定浪涌以延长寿命。
  • 焊接与可靠性:采用推荐的回流曲线与焊盘布局可保证封装和焊点可靠性;长期工作环境建议考虑环境湿度与振动影响。

六、封装与品质

RS3MF 采用 SMAF 独立式封装,便于在多种 PCB 布局中实现可靠连接。晶导微电子出品,关注量产一致性与质量控制,请在量产前索取并核对器件的最新规格书与可靠性认证资料。

如需更详细的热阻、极限参数或典型特性曲线,请参考晶导微电子官方数据手册或向供应商索取样片进行实际验证。

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