WMSIC Electronic Components

Jingdao Microelectronics BZT52C15SW

ModelBZT52C15SW
PackageSOD-323W
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic BZT52C15SW
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
BZT52C15SW
Electronic Component
1
Package
SOD-323W
Electronic Component
Zener Diode
Electronic Component
0.027g
Electronic Component
50
(Zzk)
200Ω
(Zzt)
30Ω
Electronic Component
BM0257561896
Diode
1
Current(Ir)
100nA
Power Dissipation(Pd)
200mW
Electronic Component
13.8V~15.6V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C15SW 产品概述

BZT52C15SW 是晶导微电子推出的一款独立式小功率稳压二极管,标称稳压值为 15V。该器件采用 SOD-323W 小封装,适合空间受限的表面贴装场合,具有低泄漏电流和较好的稳压特性,常用于低功耗基准、稳压与保护电路中。

一、主要特性

  • 独立式稳压二极管,型号:BZT52C15SW(晶导微电子)
  • 标称稳压值:15V(实际范围:13.8V ~ 15.6V)
  • 反向电流 Ir:100nA @ 10.5V(泄漏电流极小,适合高阻抗应用)
  • 耗散功率 Pd:200mW(器件最大耗散)
  • 阻抗:Zzt = 30Ω(测试工况下动态阻抗);Zzk = 200Ω(低电流拐点阻抗)
  • 工作结温范围:-55℃ ~ +150℃
  • 封装:SOD-323W(表面贴装,小型化)

二、电气性能解读

BZT52C15SW 在规定测试电流下显示出典型的动态阻抗 Zzt = 30Ω,说明在工作电流较高时具有较好的稳压能力;而 Zzk = 200Ω 表示在接近击穿拐点、极低电流条件下稳压特性会变差,因此在设计时应保证足够的稳流以维持稳定输出。极低的反向泄漏([email protected])使其在高阻抗参考和偏置电路中效果优良。

器件最大允许的总电流可由 Pd 限定:最大 Iz+IL ≈ Pd / Vz = 200mW / 15V ≈ 13.3mA。建议在实际设计中留安全裕量(例如不超过额定功率的 50%~70%)以提高可靠性与寿命。

三、典型应用场景

  • 小功率基准电源与偏压生成(例如对模拟前端、传感器提供稳定参考)
  • 简单的稳压与稳流电路(作为并联稳压元件)
  • 输入浪涌或过压保护(与限流器件配合)
  • 波形裁剪、过压检测与电平钳位

四、设计与选用注意事项

  • 稳压时需在二极管与电源间串联限流电阻 R,计算公式: R = (Vin - Vz) / (Iz + IL) 并确保 Pd >= Vz × (Iz + IL);同时考虑最大环境温度对功耗的降额影响。
  • 若需要较高精度稳压,应选择稳定工作电流点(远离击穿拐点),以减小由 Zzt 引起的电压变化。
  • 对于低噪声或高精度参考,可在二极管并联电容以滤除瞬态噪声,但注意不要造成启动延迟或振荡。
  • 封装热阻较大,尽量在 PCB 上提供足够的铜箔散热路径,避免局部过热。

五、封装与焊接建议

SOD-323W 为小型表面贴装封装,建议按常规无铅回流焊工艺安装(参考器件实质性数据手册中的回流曲线)。装配时注意焊盘尺寸与锡膏量匹配,减少热应力与焊点应力集中;高温回流后应避免反复高温循环以保护结温寿命。

六、可靠性与储存

工作结温范围广(-55℃ ~ +150℃),适合工业温度等级应用。长期可靠性受结温、功耗和环境(潮湿、机械应力)影响,建议储存、运输与回流前遵守干燥箱与防潮规范,必要时做防潮回流前烘干处理。

七、选型与采购提示

订购时请确认完整料号 BZT52C15SW、封装 SOD-323W 与所需的卷盘数量;如需替代,可在相同性能(Vz、Pd、Zzt、封装)范围内比较。使用前建议参照晶导微电子的完整数据手册获取详尽的测试条件、IV 曲线与回流焊工艺参数。

总结:BZT52C15SW 是一款适用于小功率、空间受限场合的 15V 稳压二极管,具有低泄漏、良好动态阻抗和宽工作温度范围,适合用于偏置、基准与保护等场合。在设计中应重视功耗限额与热管理,以保证长期稳定工作。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.