Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Jingdao Microelectronics BZT52C2V7
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Electronic BZT52C2V7
- Type
- Jingdao Microelectronics
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic
- Electronic Component
- BZT52C2V7
- Electronic Component
- 1
- Package
- SOD-123
- Electronic Component
- Zener Diode
- Electronic Component
- 0.036g
- Electronic Component
- 1
- (Zzk)
- 600Ω
- (Zzt)
- 100Ω
- Electronic Component
- BM0262122725
- Diode
- 1
- Current(Ir)
- 20uA@1V
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- 2.5V~2.9V
- Electronic Component
- 55℃~+150℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BZT52C2V7 — 晶导微电子 2.7V SOD-123 稳压二极管 概述
一、产品简介
BZT52C2V7 为晶导微电子出品的独立式稳压二极管（齐纳二极管），标称稳压值 2.7V，实际稳压范围 2.5V~2.9V，常用于小功率电源参考与过压钳位。器件以 SOD-123 表面贴装封装提供，适合体积受限的消费类与工业电子产品。
二、主要参数与特性
- 稳压值（标称）：2.7V；范围：2.5V ~ 2.9V。
- 反向漏电流 Ir：20 μA @ 1.0V，低漏泄，有利于低功耗电路。
- 动态阻抗 Zzt：100 Ω（在指定测试电流下），动态阻抗决定电压随电流变化的敏感度。
- 最大耗散功率 Pd：500 mW（环境条件下的额定耗散），须考虑封装与散热条件。
- 封装：SOD-123，适配常规 SMT 工艺。
三、典型应用
- 基准电压源与基准参考电路（低成本、低功耗场合）。
- 输入浪涌或瞬态过压钳位保护。
- 偏置稳压与电路去耦。
- 小信号限幅器与电平移位。
四、电路使用建议
- 串联限流电阻计算：R = (Vin − Vz) / Iz（Iz 为工作电流，需考虑负载电流）。
- 功耗校核：器件耗散 Pz = Vz × Iz；理论最大直流电流 Imax ≈ Pd / Vz ≈ 500mW / 2.7V ≈ 185mA，但受 SOD-123 封装热阻与环境温度限制，应适当降额使用并遵循器件温升规范。
- 由于 Zzt ≈ 100 Ω，电压对电流变化较敏感，若要求更稳的参考电压，应在较恒定的测试电流点工作或选用低阻抗型号。
- 注意温度对稳压值与漏电流的影响，在高温环境下漏电流与温漂会增加，需在设计中留余量。
五、封装与可靠性注意
SOD-123 适合回流焊装配，便于自动化贴装。为保证长期可靠性，应注意 PCB 散热设计：加大焊盘铜箔、尽量缩短热路径、避免长期在额定 Pd 附近工作。建议根据实际工况进行老化与环境应力测试。
六、选型与采购建议
选择时确认稳压范围与测试电流条件，必要时索取完整数据手册核对温度系数、测试电流 Iz、浪涌能力和热阻参数。晶导微电子 BZT52C2V7 适合对体积和成本敏感但对精度要求中等的应用场景。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
