WMSIC Electronic Components

Jingdao Microelectronics MM3Z5V1B

ModelMM3Z5V1B
PackageSOD-323
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic MM3Z5V1B
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
MM3Z5V1B
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.028g
Electronic Component
1
(Zzt)
130Ω
Electronic Component
BM0230630738
Diode
1
Power Dissipation(Pd)
300mW
Electronic Component
5V~5.2V
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MM3Z5V1B 产品概述

MM3Z5V1B 是晶导微电子推出的一款独立式低功耗稳压二极管,标称稳压值为5.1V(实际范围5.0V~5.2V),采用 SOD-323 表面贴装封装,适用于电源基准、偏置稳压与小电流过压保护等场合。器件具有低反向漏流和较低的结温工作范围,便于在空间受限的移动设备与工业控制板上应用。

一、主要参数

  • 稳压值(标称):5.1V(范围 5.0V ~ 5.2V)
  • 反向电流 Ir:2 μA @ 1.5V
  • 耗散功率 Pd:300 mW(注意板上散热条件影响实际可用功率)
  • 阻抗 Zzt:约 130 Ω(表示动态阻抗,对稳压精度有影响)
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SOD-323(小体积独立二极管)

二、特点与应用场景

  • 特点:体积小、反向漏流低、适合低功耗参考与偏置回路;SOD-323 便于自动贴装生产。
  • 典型应用:基准电压、模拟/数字电路偏置、低功耗稳压模块、信号线简单过压保护、电池供电设备的参考源等。

三、使用与设计建议

  • 功率与电流:理论最大稳压电流 Iz_max ≈ Pd / Vz = 300mW / 5.1V ≈ 59 mA;为保证可靠性建议典型工作电流远低于此值(常取 5–25 mA,视热散情况而定)。
  • 串联限流电阻示例:若输入 12V、目标 Iz = 20 mA,则 R = (12V − 5.1V) / 20mA ≈ 345 Ω;并检查在最坏工况下耗散不超过 Pd。
  • 稳压精度:Zzt = 130 Ω 意味着在小电流变化下电压有明显波动,需在需要高精度基准时并联低噪声放大或选用精密参考源。
  • 散热:SOD-323 封装散热受限,建议在 PCB 上使用相对较大的铜箔作为散热路径并考虑环境温度对 Pd 的降额。

四、封装与安装注意

  • SOD-323 为两引脚表贴封装,焊接时避免过热、掌控回流曲线以保护器件。
  • 贴装建议:合理布局接地/散热铜箔,保持引脚与走线畅通以利散热与测量点布置。
  • 贮存与防静电:按常规半导体器件防静电与防潮要求处理。

五、测试与替代型号

  • 推荐在设计验证时测量 Vz 在目标 Iz 条件下的值、反向漏流与温度漂移,并做热仿真验证板级耗散。
  • 常见可替代型号(功能相近,选型前请核对电气参数与封装):BZT52C5V1、BZT52B5V1 等。

MM3Z5V1B 适合用于对体积和成本敏感、需要低功耗参考或简单稳压的应用场景。选型时请结合实际工作电流、环境温度与 PCB 散热条件进行功率降额和电路保护设计。若需完整器件曲线与更详尽的封装尺寸、回流曲线,请索取晶导微电子的正式数据手册。

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