WMSIC Electronic Components

Jingdao Microelectronics BZT52C3V3

ModelBZT52C3V3
PackageSOD-123
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic BZT52C3V3
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
BZT52C3V3
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.036g
Electronic Component
1
(Zzt)
95Ω
Electronic Component
BM0230856408
Diode
1
Current(Ir)
5uA@1V
Power Dissipation(Pd)
500mW
Electronic Component
3.1V~3.5V
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C3V3 产品概述

一、产品简介

BZT52C3V3 为晶导微电子推出的独立式稳压二极管,标称稳压值 3.3V(允许范围 3.1V~3.5V),采用 SOD-123 小型贴片封装。此型号属于小功率稳压齿轮,适用于空间受限的电路板上作为基准或尖峰钳位元件使用。

二、主要电气参数

  • 标称稳压:3.3V(3.1V~3.5V)
  • 反向漏电流 Ir:5 μA @ 1.0V
  • 耗散功率 Pd:500 mW(整器件最大耗散)
  • 动态阻抗 Zzt:95 Ω(表征小信号条件下的内阻)
  • 封装:SOD-123
  • 品牌:晶导微电子

三、典型应用场景

  • 3.3V 低功耗电路的局部基准/稳压(小电流场合)
  • 信号线过压钳位与浪涌吸收
  • MCU/外设上电保护、通讯接口保护(例如串口、I/O 钳位)
  • 低成本电源调节与偏置电路

四、设计与使用建议

  • 工作电流计算:串联限流电阻 R = (Vin - Vz) / Iz,Iz 为流过稳压二极管的工作电流。为兼顾稳压性能与功耗,常见设计中 Iz 多为 1~20 mA,但应根据系统要求与器件耗散限制调整。
  • 功耗核算:理论最大电流 Imax ≈ Pd / Vz ≈ 0.5W / 3.3V ≈ 151 mA。但该值为器件极限,建议在实际应用中进行充分降额(通常远小于此值),并留出温升余量。
  • 稳压精度:Zzt=95 Ω 表示在小信号范围内阻抗偏大,电流变化会引起明显压降变化;需保证稳压电流稳定或采用更低阻抗的参考源以获得更佳精度。
  • 低漏电场合:Ir 仅 5 μA(1.0V 条件下),适合需要低反向漏电的便携/待机电路。

五、封装与可靠性注意事项

SOD-123 为常用小型贴片封装,适配常见 PCB 布局与回流焊工艺。焊接时注意遵循晶导微电子推荐的焊接温度曲线与回流时间,避免超温或长时间高温造成性能退化。器件在高温或散热受限的封装环境中需额外关注 Pd 限制。

六、选型要点

选择 BZT52C3V3 时,请评估实际稳压电流、允许功耗与所需稳压精度。若需要更精确的 3.3V 参考或更大功率余量,应考虑精密参考源或功率更高的封装型号。若需帮助计算限流、热设计或电路实例,可提供 Vin、电流及空间约束等参数以便给出针对性建议。

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