WMSIC Electronic Components

Jingdao Microelectronics MM3Z5V6

ModelMM3Z5V6
PackageSOD-323
BrandElectronic
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Electronic MM3Z5V6
Type
Jingdao Microelectronics
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic
Electronic Component
MM3Z5V6
Electronic Component
1
Package
SOD-323
Electronic Component
Zener Diode
Electronic Component
0.028g
Electronic Component
1
(Zzt)
80Ω
Electronic Component
BM0229356804
Diode
1
Power Dissipation(Pd)
200mW
Electronic Component
5.2V~6V
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MM3Z5V6 产品概述

一、产品简介

MM3Z5V6 是晶导微电子推出的一款独立式稳压二极管(Zener 二极管),标称稳压值为 5.6V,稳压值允许范围为 5.2V ~ 6.0V。该器件采用 SOD-323 小封装,适用于对体积和成本有较高要求的表贴电路,用作过压钳位、基准电压源与电路保护等场合。

二、主要电气与热特性

  • 稳压值(标称):5.6V
  • 稳压值(允许范围):5.2V ~ 6.0V
  • 反向电流 Ir:1 μA @ 2.5V(厂家给定测量点)
  • 耗散功率 Pd:200 mW(最大)
  • 阻抗 Zzt:80 Ω(影响低电流下的稳压特性)
  • 工作结温范围:-55 ℃ ~ +150 ℃
  • 封装:SOD-323(表面贴装)

需要注意:在 200 mW 的功耗限制下,器件在稳压状态下的最大直流电流近似为 Imax ≈ Pd / Vz ≈ 200 mW / 5.6 V ≈ 35.7 mA。实际使用中应考虑封装散热、印刷电路板(PCB)面积和环境温度对结温的影响,并适当降额以保证长期可靠性。

三、主要特点与优势

  1. 小体积表贴封装(SOD-323),便于高密度 PCB 布局与自动化贴装。
  2. 低反向泄漏电流(示例:1 μ[email protected]),适合对泄漏敏感的电路。
  3. 额定耗散功率适中(200 mW),可满足中小电流稳压与钳位需求。
  4. 宽工作结温范围(-55℃ ~ +150℃),能够适应一般工业温度环境。
  5. 合理的阻抗(80 Ω)在低至中等电流范围内提供稳定的电压特性。

四、典型应用场景

  • 作为参考电压源,用于小功率模拟电路和基准电路。
  • 电源轨过压保护与瞬态钳位(需配合限流电阻)。
  • 通信设备、便携式设备、传感器前端的简单稳压或钳位电路。
  • 样机与批量生产中对成本和空间敏感的解决方案。

五、使用建议与注意事项

  • 推荐串联限流电阻:在稳压二极管工作时务必添加串联电阻以限制电流,防止超过 Pd 导致过热损坏。
  • 热管理:SOD-323 为小型封装,散热能力有限;在高环境温度或连续较大电流场合,应通过增大铜箔面积或加散热片等手段降低结温,或减少工作电流。
  • 工作点选择:由于 Zzt(80 Ω)和稳压范围的存在,在需要高精度稳压的场合应选用更高精度参考源;若用于钳位和保护,当前器件性能完全满足。
  • 焊接与可靠性:遵循 SMD 焊接工艺规范,避免过高回流温度超出器件最大允许值,保证封装和内部焊点可靠性。
  • 储存与处理:避免静电和潮湿环境,按标准 SMD 器件要求进行湿敏等级(MSL)管理与回流前烘烤处理(如适用)。

六、封装与订购信息

  • 品牌:晶导微电子
  • 型号:MM3Z5V6
  • 封装:SOD-323(表面贴装)
  • 典型包装:卷带盘装(适配自动贴片生产)

总结:MM3Z5V6 是一款面向小体积、低成本稳压与保护应用的 5.6V 封装型稳压二极管。其低泄漏、适中的功耗和广泛的工作温度范围,使其在便携设备、通信模块和一般电子产品中具备良好的实用性。设计时需注意功率与热管理,以保证长期稳定运行。

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