Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
JSMSEMI(杰盛微) BAV21WS
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JSMSEMI BAV21WS
- Type
- JSMSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JSMSEMI
- Electronic Component
- BAV21WS
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Switch Diode
- Electronic Component
- 0.026g
- Electronic Component
- 1
- Electronic Component
- BM0228089650
- Current
- 200mA
- Diode
- Electronic Component
- Current(Ir)
- 100nA@200V
- (Vf)
- 1.25V@200mA
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 65℃~+150℃@(Tj)
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BAV21WS — 产品概述
一、产品简介
BAV21WS 是杰盛微（JSMSEMI）推出的一款独立式小信号整流/开关二极管，采用 SOD-323 表面贴装封装。该器件在高达 200V 的反向电压下具有极低的反向漏电流和较快的开关特性，适合用于空间受限的高电压小电流应用场合。
二、主要电气参数
- 二极管配置：独立式
- 正向压降 (Vf)：1.25 V @ 200 mA
- 直流反向耐压 (Vr)：200 V
- 最大整流电流：200 mA（直流）
- 耗散功率 (Pd)：200 mW
- 反向电流 (Ir)：100 nA @ 200 V
- 反向恢复时间 (Trr)：50 ns
- 非重复峰值浪涌电流 (Ifsm)：2.5 A
- 工作结温范围：-65 ℃ ~ +150 ℃（Tj）
- 封装：SOD-323
三、关键特性与优势
- 高耐压：200 V 反向耐压使其能胜任高压整流与保护任务。
- 低漏电：在高电压条件下 Ir 仅 100 nA，适用于需要低泄漏的测量与高阻电路。
- 中等正向压降：Vf=1.25 V @200 mA，在承载 100~200 mA 级别时仍能保持稳定导通特性。
- 快速恢复：Trr=50 ns，适合中高速开关应用及脉冲整流场景。
- 小型化封装：SOD-323 适合高密度 PCB 布局与自动贴装工艺。
四、典型应用
- 高压小电流整流与反向保护（如电源输入侧、检测回路）
- 开关电源中的高压脉冲或取样电路
- 信号钳位、浪涌钳位与稳压辅助电路
- 仪表、仪器中对低漏电与高耐压有要求的前端电路
五、封装与热管理建议
SOD-323 为极小型封装，热阻较大，器件耗散功率仅 200 mW。推荐在 PCB 设计中：
- 增加器件引脚及附近的铜箔面积，以改善散热；
- 在可能的情况下使用多层铜平面作为散热路径；
- 对于连续 100~200 mA 工作点，应考虑按结温降额并留有余量，避免长时间在最高 Pd 下运行。具体降额曲线与焊接温度范围请参照厂商数据手册。
六、使用与可靠性要点
- 在高压环境下使用前应做好元件测试与分选，注意静电防护（ESD）。
- 波峰/回流焊接工艺应遵循 SOD-323 的热循环限制，防止封装和焊点应力。
- 长期高温或频繁浪涌会缩短寿命，建议在设计时预留余量并进行必要的温升和冲击测试。
- 订购或批量使用时，请向供应商确认包装形式、湿敏等级及完整数据手册以获得准确可靠的应用指导。
如需电气特性曲线、典型应用电路或 PCB 封装建议图，请提供联系方式或要求，我可基于原厂资料为您整理更详细的设计参考。
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