WMSIC Electronic Components

JSMSEMI ZMM3V3

ModelZMM3V3
PackageLL-34
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI ZMM3V3
Type
JSMSEMI
Minimum package
2500

Technical parameters

Electronic Component
JSMSEMI
Electronic Component
ZMM3V3
Electronic Component
1
Package
LL-34
Electronic Component
Zener Diode
Electronic Component
0.048g
Electronic Component
1
(Zzk)
600Ω
(Zzt)
90Ω
Electronic Component
BM0229961407
Diode
1
Current(Ir)
2uA@1V
Power Dissipation(Pd)
500mW
Electronic Component
3.1V~3.5V
Electronic Component
2500
Electronic Component
3.3V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

ZMM3V3(JSMSEMI)3.3V 稳压二极管 产品概述

一、产品概述

ZMM3V3 是 JSMSEMI(杰盛微)推出的一款小功率稳压二极管,标称稳压值为 3.3V,实际稳压范围为 3.1V~3.5V,适用于对电压有中低功耗稳压或钳位保护要求的场合。器件以 LL-34 小型表面贴装封装提供,适合体积受限的消费类、通信和工业电子产品。

二、主要电气参数

  • 稳压值(标称):3.3V
  • 稳压值(范围):3.1V~3.5V
  • 最大耗散功率(Pd):500mW
  • 反向漏电流(Ir):2 μA @ 1V
  • 阻抗(Zzk):600 Ω
  • 阻抗(Zzt):90 Ω
  • 品牌/型号:JSMSEMI / ZMM3V3
  • 封装:LL-34(小型 SMD)

三、性能要点说明

  • 稳压与阻抗:Zzk(600Ω)与 Zzt(90Ω)分别反映器件在不同工作点下的小信号阻抗特性。Zzk 值较高表明在极低偏置或接近击穿拐点时稳压能力弱;Zzt 较低则说明在规定工作电流附近能提供较好的动态稳定性和较小的电压波动。
  • 功率与热限:500mW 的耗散上限决定了器件适合低至中等电流的箝位或分流稳压应用。理论上最大允许电流 Iz_max ≈ Pd / Vz ≈ 0.5W / 3.3V ≈ 151mA,但实际使用需考虑封装散热、环境温度与热阻,通常应远低于此极限并作热功率余量。
  • 漏电流与高阻电路:Ir = 2 μA(1V)表示反向泄漏相对较小,适合用于对漏电敏感的高阻输入或电平检测电路,但在极高阻抗测量场合仍需注意微安级漏电影响。

四、典型应用场景

  • 低功耗分流稳压(为小型传感器或逻辑电路提供 3.3V 基准)
  • 电压钳位与浪涌保护(限制瞬态过压,保护下游器件)
  • 波形裁剪、基准电压源及偏置电路
  • 消费类与便携设备中的局部稳压与保护电路

五、使用与选型建议

  • 作为分流稳压器使用时,建议按实际输入电压与负载计算串联限流电阻:R = (Vin - Vz) / Iz;并验证在预期最大 Iz 下的功率 Pd = Vz × Iz 不超过 0.5W,且考虑热余量。
  • 若需较好稳压精度,应选择使工作电流接近器件标准测试区间(通常为几毫安级),以利用较低的 Zzt 获取更稳的输出。
  • 在高温或散热受限环境中,应降低工作电流或选择更大功率的器件以避免热失效。
  • 对高阻或微弱信号电路,考虑漏电流对偏置的影响,必要时增加隔离或采用低漏型零件。

六、封装与可靠性提示

LL-34 小型 SMD 封装便于自动贴装生产,适合批量制造。装配时遵循标准回流焊工艺并注意防潮、防静电。为确保长期可靠性,建议在 PCB 布局中为稳压二极管留出散热路径,并避免将热源直接叠放在器件上方。

总结:ZMM3V3 提供了在小体积、低至中等功耗条件下可靠的 3.3V 稳压与过压钳位能力,适合多种消费与工业电子设计。选型时请根据实际电流、散热条件与精度需求合理留余量。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.