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JSMSEMI 1SS355
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JSMSEMI 1SS355
- Type
- JSMSEMI
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JSMSEMI
- Electronic Component
- 1SS355
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Switch Diode
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM0258858048
- Current
- 100mA
- Diode
- Electronic Component
- Current(Ir)
- 100nA@80V
- (Vf)
- 1.2V@100mA
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1SS355 产品概述
一、产品简介
1SS355 是杰盛微（JSMSEMI）推出的一款独立式小信号整流/开关二极管，采用 SOD-323 封装。器件体积小、反向耐压高、恢复时间短，适用于便携式消费电子和高速开关电路中的信号整流与保护应用。
二、主要电气参数
- 正向压降（Vf）：1.2V @ If = 100mA
- 直流反向耐压（Vr）：80V
- 直流整流电流（If）：100mA（连续）
- 反向电流（Ir）：100nA @ Vr = 80V
- 反向恢复时间（Trr）：4ns（快速恢复，适合高频开关）
- 非重复峰值浪涌电流（Ifsm）：500mA（瞬态）
- 工作结温范围：-55℃ ~ +125℃
三、性能亮点
- 高频响应快：4ns 的反向恢复时间使其在开关频率较高的电路中能有效减少开关损耗与交越干扰。
- 低漏电：在最大反向电压下仅有约100nA 的反向电流，适合对漏电敏感的低功耗设计。
- 高耐压：80V 的反向耐压能够覆盖常见的中低压应用场景。
- 微型封装：SOD-323 占板面积小，利于高密度 PCB 布局和便携设备应用。
四、典型应用场景
- 高频开关和信号整流电路（如射频前端、扫描与检测线路）
- 低功耗便携设备中的保护与整流（键盘扫描、传感输入）
- 电平移位与钳位电路，用于保护后级器件免受反向电压冲击
- 通讯设备、仪器仪表中的快速恢复需求场合
五、使用与设计建议
- 连续工作电流建议参考额定整流电流 100mA，长期使用应在此范围内留有余量以延长寿命。
- 对于瞬态浪涌，器件可承受 500mA 的非重复峰值浪涌，但应限制脉冲宽度并保证足够的散热。
- 在高频应用中，合理布局走线与旁路电容可以减少寄生电感和环路面积，发挥短 Trr 的优势。
- 避免长期在高温高压条件下工作，反向漏电随温度升高而增大，应考虑结温与环境温度的热平衡与散热设计。
六、封装与焊接注意
SOD-323 为贴片封装，适合回流焊工艺。焊接时遵循标准回流温度曲线，避免长时间超出最高回流温度以免影响封装可靠性。焊盘设计应保证良好焊锡填充且便于热量散出，便于生产和后期维护。
七、选型与采购提示
选型时以 Vf、Vr、If、Trr 与封装兼容性为主要考量。杰盛微 JSMSEMI 的 1SS355 在中低功率、高速开关场景具有良好性价比。大量采购时建议确认包装方式（卷带、切带）与出货检验报告，以确保批次一致性与可靠性。
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