WMSIC Electronic Components

JSMSEMI SMF70A

ModelSMF70A
PackageSOD-123W
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI SMF70A
Type
JSMSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
SMF70A
Electronic Component
1
Package
SOD-123W
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.032g
Electronic Component
1
Electronic Component
BM0264819490
Operating Temperature
55℃~+150℃
Voltage
113V
Current(Ir)
1uA
Voltage(VBR)
78.8V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMF70A 产品概述

一、产品简介

SMF70A 是 JSMSEMI(杰盛微)推出的一款单向瞬态电压抑制器(TVS),专为表面贴装(SMD)电路保护而设计。器件采用 SOD-123W 小型封装,体积小、热性能好,适合在空间受限的电路板上对直流电源线或信号线进行瞬态过压保护,有效吸收雷击、开关瞬变和电感负载回路产生的高能脉冲。

二、主要电气参数

  • 极性:单向(Unidirectional)
  • 反向稳态电压 Vrwm:70 V
  • 击穿电压 VBR(测量值):约 78.8 V
  • 钳位电压 Vc(典型):113 V(Ipp 条件下)
  • 峰值脉冲电流 Ipp:1.8 A
  • 峰值脉冲功率 Ppp:200 W(10/1000 μs 波形)
  • 反向漏电流 Ir:≈ 1 μA(在 Vrwm 条件下)
  • 工作温度范围:-55 °C ~ +150 °C
  • 类型:单向 TVS
  • 品牌:JSMSEMI(杰盛微)
  • 封装:SOD-123W(表面贴装)

三、关键特性与优点

  • 高效瞬态抑制:在 10/1000 μs 的行业标准脉冲条件下,器件可承受 200 W 峰值脉冲功率,能吸收较长时间的浪涌能量,适合电源与线路的防雷和浪涌保护。
  • 低漏电流:1 μA 的低反向漏电流有利于在待机或低功耗设备中减少静态能耗。
  • 突发电流保护能力:1.8 A 的峰值容流能力在小封装下提供可靠的瞬态保护。
  • 宽温度范围:-55 °C 到 +150 °C 的工作温度适应工业级环境及某些苛刻工作条件。
  • 表面贴装封装:SOD-123W 适用于自动化贴片生产,节省 PCB 空间并简化装配工艺。

四、典型应用场景

  • DC 供电总线保护(直流电源防浪涌,Vrwm=70V 级别)
  • 工业控制设备、电动工具等开关瞬变抑制
  • 通信设备与基站的电源及信号线防护
  • 仪器仪表、安防与监控系统的浪涌保护
  • 电池供电或逆变/充电系统中对过压瞬变的抑制

五、选型与使用建议

  • 工作电压匹配:Vrwm(70 V)为器件在反向稳态下的最大额定电压,应选择器件时确保系统连续工作电压不超过该值;通常推荐留有安全余量(例如系统电压 ≤ Vrwm 的 90% 左右),避免长时间接近 Vrwm 导致热应力或漏电上升。
  • 钳位考虑:钳位电压 113 V 表明在峰值脉冲条件下器件将把瞬态电压钳制在该水平,设计时需确认被保护器件能承受此钳位电压。
  • 波形依赖性:Ppp(200 W)与 Ipp(1.8 A)基于 10/1000 μs 波形。不同脉冲宽度下的能量吸收能力会变化,实际应用中需按照系统可能出现的脉冲类型评估。
  • 布局建议:将 TVS 靠近被保护端(如电源入口或信号接口)焊接,尽量缩短与被保护节点之间的走线,减小串联感抗以提高响应速度。
  • 极性连接:作为单向 TVS,通常把阳极接地,阴极接至被保护正极(或相应按电路实际方向连接),以保证正向短路行为和反向钳位功能。

六、封装与安装

SMF70A 采用 SOD-123W 小外形表面贴装封装,适配现代 SMT 工艺。该封装有利于散热与自动化装配。建议按厂家推荐的回流焊曲线和 PCB 焊盘模型进行布局与焊接,避免过热影响器件可靠性。贴装位置应考虑散热通道与热沉设计,必要时在 PCB 上使用散热铜箔改善热扩散。

七、可靠性与工作环境

  • 器件设计用于宽温环境(-55 °C ~ +150 °C),可适应工业级温度波动。
  • 长期稳态工作不应长期在 Vrwm 附近,以减少漏电流上升与热应力对寿命的影响。
  • 对于频繁、高能量的脉冲应用,应评估器件在多次冲击下的累积损伤情况,必要时采用并联或更高等级的 TVS 以提高寿命。

八、订购信息与支持

型号:SMF70A
品牌:JSMSEMI(杰盛微)
封装:SOD-123W(SMT)
如需批量采购、样品或获取完整数据手册、封装尺寸和回流焊建议,请联系 JSMSEMI 官方渠道或授权分销商,获取最新的器件规格书与可靠性试验数据。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.