WMSIC Electronic Components

JSMSEMI SGM2019-1.8YN5G/TR SGM2019

ModelSGM2019-1.8YN5G/TR
PackageSOT-23-5
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI SGM2019-1.8YN5G / TR
Type
JSMSEMI
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
250mV@(300mA)
Electronic Component
JSMSEMI
Electronic Component
SGM2019-1.8YN5G/TR
Electronic Component
1
Package
SOT-23-5
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.038g
Electronic Component
1
Electronic Component
BM0229961414
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
5.5V
Output
Electronic Component
Output Voltage
1.8V
Output Current
300mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SGM2019-1.8YN5G/TR 产品概述

一、产品简介

SGM2019-1.8YN5G/TR 是一款来自 JSMSEMI(杰盛微)的固定输出、正极性线性低压差稳压器(LDO),输出电压为 1.8V,输出通道数为单路,采用 SOT-23-5 小封装,适用于空间受限且对电源噪声、待机功耗有严格要求的场合。器件集成使能控制和过热保护功能,工作温度范围为 -40℃ 至 +85℃(Ta),便于嵌入式系统电源管理设计。

二、主要电气参数

  • 输出类型:固定(1.8V)
  • 输出极性:正极
  • 工作电压(最大):5.5V
  • 最大输出电流:300mA
  • 压差(Dropout):250mV @ 300mA
  • 静态电流(Iq):典型 2 μA(低静态电流,利于待机节能)
  • 电源纹波抑制比(PSRR):80 dB @ 100 Hz(优异的低频纹波抑制)
  • 特性:带使能(EN)端、过热保护
  • 封装:SOT-23-5
  • 工作温度:-40℃ ~ +85℃(Ta)

三、核心特性与优势

  • 低静态电流:约 2 μA 的静态电流非常适合电池供电和低功耗待机应用,可延长系统待机时间。
  • 低压差运行:在满载 300mA 时压降仅 250mV,有利于在较低输入余量下仍维持稳定 1.8V 输出,提高系统效率。
  • 高 PSRR:100Hz 时 80dB 的抑制能力,能显著降低输入端开关电源或系统噪声对敏感模拟/射频电路的影响。
  • 使能与保护:片上使能引脚便于系统软件或外部控制器对电源进行开关管理;过热保护提高可靠性,防止在异常工况下损坏器件或负载。

四、典型应用场景

  • 便携式设备与电池供电终端(MCU、传感器节点、电源域切换)
  • 工业与通信终端的数模混合电源(对低频纹波敏感的模拟前端)
  • 智能传感器、手持设备、物联网终端的 1.8V 核心/外设供电
  • 需要低静态电流和快速可控上电的功率管理子系统

五、使用与布局建议

  • 输入/输出旁路:建议在输入和输出端分别放置足够的去耦电容以保证稳定性,常见做法为在输出端并联陶瓷电容(例如 1µF 至 10µF)并注意器件对输出电容等效串联电阻(ESR)的兼容性;具体电容数值与 ESR 请参考厂方应用/数据手册以获得最佳性能与稳定性。
  • 散热与布局:虽然封装小巧,但在接近最大输出电流且输入-输出压差较大时会产生较多功耗,建议将热敏感引脚的铜箔面积适当加大以提高散热能力,并尽量缩短输入电容到器件的回流路径。
  • 使能控制:使能端用于软启动与节能控制,接入 MCU 或外部逻辑时注意使能电平及上电顺序对系统的影响;具体阈值与时序请参照完整数据手册。
  • 可靠性:利用过热保护功能应对异常工况,但仍需在设计中考虑输入浪涌、短路保护与外部限流等系统级保护策略。

六、封装与选型提示

SGM2019-1.8YN5G/TR 采用 SOT-23-5 小封装,适合空间受限的 PCB 布局。选型时请确认系统电压头房(Vin 与 1.8V 之间的差值)、最大负载电流以及热耗散需求;若系统对更高电流、不同输出电压或更宽工作温度有需求,请参考厂方系列中其它规格型号。

备注:以上为基于器件关键参数的产品概述,具体电气特性曲线、引脚定义、使能阈值、输出电容要求与典型应用电路,请以厂方正式数据手册为准。

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