WMSIC Electronic Components

JSMSEMI AO4805

ModelAO4805
PackageSOP-8
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI AO4805
Type
JSMSEMI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
AO4805
Electronic Component
1
Package
SOP-8
Electronic Component
2 P
Electronic Component
MOSFET
Electronic Component
0.32g
Electronic Component
1
Electronic Component
BM0257658607
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
2.1W
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
30V
Capacitor(Ciss)
1.8nF

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

AO4805 — 产品概述

一、概述

AO4805 是由 JSMSEMI(杰盛微)推出的一款双通道 P 沟道功率 MOSFET,双管封装于 SOP-8 体积内,针对低压、高效率的高侧开关与功率管理应用进行了优化。器件在小型化封装下提供较低的导通电阻和较高的电流能力,适用于电池供电设备、电源保护、负载切换等场合。

二、主要参数(重点规格)

  • 通道数:2 个 P 型 MOSFET(双通道)
  • 漏源耐压 Vdss:30 V
  • 连续漏极电流 Id:9 A(热限及封装散热条件下)
  • 导通电阻 RDS(on):19 mΩ @ |Vgs|=4.5 V, Id=5 A(典型测试条件)
  • 耗散功率 Pd:约 2.1 W(SOP-8 封装,依散热条件变化)
  • 栅源阈值电压 |Vgs(th)|:约 2.5 V(注意为阈值绝对值,P 沟道取负向驱动)
  • 总栅极电荷 Qg:30 nC @ 15 V
  • 输入电容 Ciss:1.8 nF @ 15 V
  • 反向传输电容 Crss:216 pF @ 15 V
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOP-8
  • 品牌:JSMSEMI(杰盛微)

三、特点与优势

  1. 低导通电阻:19 mΩ(在 |Vgs|=4.5V 下)有利于减小导通损耗,提高效率。
  2. 双通道集成:两个 P 沟道 MOSFET 集成于一个 SOP-8 封装,节省 PCB 面积,方便做高侧双路控制或并联以降低等效 RDS(on)。
  3. 合理的栅极电荷:Qg 30 nC(15V)在开关能量与驱动能量之间取得平衡,适用于中低频开关场合。
  4. 宽温度范围与工业级可靠性,适合一般消费与工业电子应用。

四、典型应用场景

  • 电源管理与高侧开关(便于在正电源侧实现断开控制)
  • 电池供电的电源路径切换与反向电流阻断
  • 便携设备与充电管理电路
  • DC-DC 转换器中的补充开关或保护开关
  • 小功率电机/执行器驱动与负载切换

五、使用建议与注意事项

  • 栅极驱动:P 沟道 MOSFET 的栅源电压为 Vg−Vs,典型 RDS(on) 测试在 |Vgs|=4.5V 条件下,建议保证栅压幅度足以使器件完全导通(参考 |Vgs|=4.5V 或更大驱动电压),并注意栅压不要超过器件最大额定 Vgs(请查阅完整数据手册)。
  • 热管理:SOP-8 封装的功耗 Pd 受 PCB 铜面积和散热方式影响明显。需在 PCB 设计中增加散热铜箔和必要的过孔/散热片以确保在高电流条件下的可靠工作。
  • 布线与封装:尽量缩短漏极/源之间的互连长度,使用较宽的铜箔降低导通电阻和热阻。关键信号建议采用 Kelvin 源测量或单独回流路径以提升测量与控制精度。
  • 开关环路与吸收:在驱动感性负载时,注意关断瞬态和寄生电感引起的过压,必要时加入 TVS、RC 吸收或缓冲电路。
  • 驱动电阻与栅极抑制:为控制开关速度并抑制振铃,推荐在栅极串联 10–100 Ω 的门阻;同时加入上拉/下拉电阻以保证器件上电/断电状态可控。
  • 并联使用:双通道可并联以降低等效 RDS(on),并联时注意匹配通道热分布与布局,避免单管过热。

六、可靠性与储存

  • 器件工作温度范围 -55℃~+150℃,但长期可靠性依赖于工作点与散热设计,请在额定条件下使用。
  • SOP-8 为常见封装,建议按 JEDEC 标准处理其潮湿敏感性(若需回流焊,遵循厂方回流曲线和烘烤建议)。

七、总结

AO4805 提供了在小体积 SOP-8 封装下较低的导通电阻和较高的电流承载能力,双 P 沟道的设计使其在高侧开关、电源管理与电池路径切换等应用中具有较好性价比。合理的驱动与 PCB 散热设计可以充分发挥器件性能,满足便携设备与工业控制等多种场景需求。欲获取详细最大额定值、典型特性曲线与封装尺寸,请参照厂家的完整数据手册与应用说明。

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