WMSIC Electronic Components

JSMSEMI SSIT65HVD230DR

ModelSSIT65HVD230DR
PackageSOP-8
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI SSIT65HVD230DR
Type
JSMSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
SSIT65HVD230DR
Electronic Component
1
Package
SOP-8
Type
CAN Transceiver
Electronic Component
CAN Transceiver
Electronic Component
0g
Electronic Component
1
Channel Count
1
Electronic Component
BM0230292011
Operating Temperature
40℃~+125℃
Operating Voltage
3.3V
Operating Current
2mA
Data
5Mbps
Static Current
600uA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SSIT65HVD230DR 产品概述

一、产品简介

SSIT65HVD230DR 是杰盛微(JSMSEMI)推出的一款单通道 CAN 总线收发器,采用 SOP-8 封装,面向工业级车载与嵌入式通信系统。器件工作电压为 3.3V,支持高达 5Mbps 的数据速率,工作温度范围宽 (-40℃ 至 +125℃),适用于严苛环境下的实时数据传输需求。

二、主要规格一览

  • 类型:CAN 收发器(单通道)
  • 数据速率:最高 5 Mbps
  • 工作电压:3.3V(典型)
  • 工作电流:2 mA(工作态)
  • 静态电流:600 μA(待机/静态态)
  • 工作温度:-40℃ 至 +125℃
  • 通道数:1
  • 封装:SOP-8
  • 品牌:JSMSEMI(杰盛微)

三、核心特性与优势

  • 高速传输:支持 5 Mbps,满足绝大多数高速 CAN 通信场景,适合车辆网络、电机控制与工业自动化。
  • 低功耗设计:工作电流仅 2 mA,静态电流 600 μA,有利于降低系统总功耗,适合电源受限的应用。
  • 宽温性能:-40℃ 至 +125℃ 的工业级温度范围,确保在严苛环境下的可靠性与稳定性。
  • 小尺寸封装:SOP-8 便于 PCB 布局与批量生产,兼容主流封装设计。

四、应用场景

  • 汽车电子:车载网络(车身电子、动力总成、车载诊断等);
  • 工业控制:PLC、现场总线网关、运动控制器;
  • 智能设备:楼宇控制、安防设备与能源管理系统;
  • 测试与测量:数据采集与实时通信接口模块。

五、设计与使用建议

  • 电源去耦:在 VCC 旁并联 0.1 μF 与 1 μF 陶瓷电容,靠近器件电源引脚布置,以抑制瞬态噪声。
  • 共模/差模终端:在两总线端(CAN_H/CAN_L)末端使用 120 Ω 终端电阻,必要时增加共模滤波或 TVS 器件以增强浪涌和静电防护。
  • 布线规范:总线尽量采用差分对布线,控制阻抗一致,避免走线与高频信号交叉,减小反射与干扰。
  • 工作模式切换:合理利用待机/休眠模式以降低静态功耗,设计中加入唤醒电路以满足系统响应时间需求。

六、可靠性与合规性建议

  • 在高浪涌和强电磁环境下,应配合 TVS、共模电感等保护元件提高系统抗干扰能力;
  • 如果用于车规级产品,建议在系统级别验证电磁兼容(EMC)、温度循环与热管理性能,确保长时间运行可靠。

本概述基于器件典型参数与工程实践经验整理,供方案选型与电路设计参考;在正式量产前,请结合厂商数据手册与样片测试结果进行完整验证。

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