WMSIC Electronic Components

JSMSEMI BZT52C15Q

ModelBZT52C15Q
PackageSOD-123
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI BZT52C15Q
Type
JSMSEMI
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
BZT52C15Q
Electronic Component
1
Package
SOD-123
Electronic Component
Zener Diode
Electronic Component
0.031g
Electronic Component
1
(Zzk)
200Ω
(Zzt)
30Ω
Electronic Component
BM0229934237
Diode
1
Power Dissipation(Pd)
500mW
Electronic Component
14.25V~15.75V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C15Q 稳压二极管(15V,500mW)产品概述

一、产品概述

BZT52C15Q 是 JSMSEMI(杰盛微)出品的一款小功率稳压二极管,标称稳压值 15V,允许稳压范围 14.25V~15.75V,最大耗散功率 500mW,常见封装为 SOD-123,适用于对体积和成本有较高要求的表面贴装电路。器件工作结温范围宽 (-55℃~+150℃),可满足工业级温度环境要求。

二、主要电气参数

  • 稳压值(标称):15V
  • 稳压值(允许范围):14.25V~15.75V
  • 最大耗散功率(Pd):500mW(在规定散热条件下)
  • 反向电流(Ir):100nA @ 10.5V(低漏电,有利于高阻抗电路)
  • 阻抗(Zzk):200Ω(低频或静态条件下的阻抗指标)
  • 阻抗(Zzt):30Ω(交流或瞬态条件下的动态阻抗指标)
  • 工作结温范围(Tj):-55℃~+150℃
    以上参数为关键选用依据,实际使用时应参考厂家完整数据手册以获得测试条件和典型曲线。

三、主要特性与优势

  • 稳压精度适中:15V 标称且有明确允许范围,便于在低功耗电源或参考应用中稳定输出。
  • 低漏电流:在 10.5V 条件下 Ir 仅 100nA,适合高阻抗或静态待机电路。
  • 良好瞬态响应:Zzt 30Ω 表明在交流或快速电流变化下有较好的动态稳定特性。
  • 宽温度范围:-55℃~+150℃ 满足工业级应用的可靠性要求。
  • 小尺寸封装:SOD-123 适配自动化贴装,节省 PCB 面积。

四、典型应用场景

  • 低功耗系统中作稳压参考或微功率稳压单元。
  • 模拟电路或精密测量电路中的基准或局部稳压。
  • 信号线路与接口的小电流过压或尖峰抑制。
  • 工业或车载低功耗模块(在保证热管理的前提下)。

五、设计与热管理要点

  • 功耗限制:器件 Pd 为 500mW,实际允许耗散与 PCB 散热条件密切相关,需在设计中留有余量并考虑结温上升与温度降额。
  • PCB 散热:SOD-123 为小封装,建议在焊盘处设计足够的铜箔散热面积或通过过孔连接到内层/底层散热层,以降低结温。
  • 电流选择:稳压二极管应工作在规定的电流范围内,通常通过串联电阻限制电流;动态阻抗(Zzt)会影响负载变化时的稳压精度。
  • 温度影响:漏电随温度上升而增大,稳压值也会发生漂移,设计时应评估工作环境温度对系统性能的影响。

六、封装与生产注意事项

  • 封装:SOD-123,适合回流焊工艺;具体回流曲线与焊接参数请遵照 JSMSEMI 的焊接规范。
  • 储存与防护:建议按常规半导体防潮要求干燥保存,贴片前做好防静电与防潮处理。
  • 可靠性:器件工作在高温或高功耗条件下需遵循降额使用,避免长期接近 Pd 极限。

七、选型与采购建议

在选型时,除稳压值和功耗外,还应重点核对测试条件(如测试电流、环境温度)、动态阻抗和反向漏电对系统精度的影响。若需要更高功率或更低动态阻抗的解决方案,可考虑更大封装或功率等级的稳压器件。欲获取完整电气特性曲线、测试条件和封装尺寸,请联系 JSMSEMI 或参考其正式数据手册。

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