WMSIC Electronic Components

JSMSEMI SN75176BDR

ModelSN75176BDR
PackageSOP-8
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI SN75176BDR
Type
JSMSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
SN75176BDR
Electronic Component
1
Package
SOP-8
Type
Transceiver
Electronic Component
RS-485 / RS-422IC
Electronic Component
0g
Receiver
1
Electronic Component
1
Driver
1
Electronic Component
RS-485 / RS-422IC
Electronic Component
BM0257697676
Operating Temperature
0℃~+70℃
Power Supply Voltage
4.75V~5.25V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SN75176BDR 产品概述

一、产品简介

SN75176BDR 是面向差分总线通信的单通道收发器(1 驱动器 + 1 接收器),适用于 RS-485/RS-422 类串行通信链路。该器件由 JSMSEMI(杰盛微)供应,采用 SOP-8 封装,工作电源为 5V(典型工作范围 4.75V ~ 5.25V),工作温度范围为 0℃ ~ +70℃,适合一般商业与轻工业环境。产品定位为通用型差分收发器,便于在多节点、长线缆场景中实现可靠的数据传输。

二、主要特性

  • 器件类型:收发器(1 驱动器 / 1 接收器),适配 RS-485/RS-422 差分接口规范
  • 电源电压:5V 工作电源,允许范围 4.75V ~ 5.25V
  • 工作温度:0℃ ~ +70℃(商业温度等级)
  • 封装形式:SOP-8,易于通用 PCB 装配与波峰/回流焊接工艺
  • 总线方式:差分半双工(常见应用)或按照系统设计用于全双工实现(需外部安排)
  • 品牌与来源:JSMSEMI(杰盛微)

三、典型应用场景

  • 工业自动化通信:PLC、现场总线节点之间的短/中距离数据链路
  • 楼宇控制与监控:照明控制、门禁、楼宇自控系统中的数据通讯
  • 仪器仪表:采集模块与主控单元之间的差分串行传输
  • 电机驱动与运动控制:在噪声环境下实现可靠信号传输
  • 嵌入式系统与通信接口扩展:为单片机、DSP 或 FPGA 提供 RS-485/RS-422 物理层支持

四、功能说明与使用要点

  • 差分传输:利用两个线对实现差分信号,抗干扰能力强,适合长距离及噪声环境。
  • 收发控制:器件本身集成了驱动器与接收器,通常需要外部控制 DE/RE 引脚以完成发送/接收切换(具体引脚和控制逻辑请参照厂商资料)。
  • 总线多节点:符合 RS-485 多点网络拓扑,支持多节点连接,但需按规范解决总线终端与偏置(bias)问题,避免空闲状态下的总线不确定。
  • 电源与地:稳定的 5V 电源与良好接地是保证通信稳定性的基础,建议在芯片供电端口并接去耦电容(详见设计建议)。

五、封装与引脚建议

  • SOP-8 封装便于在常规 PCB 上安装与维护。具体引脚排列(VCC、GND、A、B、DE、RE、RO、DI 等)请参考 JSMSEMI 官方数据手册,以确保正确连线与功能使用。
  • 封装可适配工业生产线常见的贴片工艺,便于批量采购与装配。

六、设计与 PCB 布局建议

  • 去耦电容:在 VCC 与 GND 之间靠近器件放置 0.1µF 陶瓷去耦电容,抑制电源瞬态。
  • 差分线布线:A/B 差分对应的 PCB 走线应尽量等长、并行、靠近,避免与数字信号交叉或形成大的回路。
  • 终端与偏置:在总线两端添加终端电阻(按系统阻抗),并在必要时添加偏置电阻以定义空闲总线电平,避免漂移或误触发。
  • 地平面与屏蔽:在噪声较大的应用中采用连续地平面,并考虑缆线屏蔽接地策略以降低共模干扰。
  • 防护措施:若现场有静电或雷击风险,建议在总线上增加浪涌抑制器件或 TVS 二极管,并在设计中考虑熔断或限流保护。

七、可靠性与采购注意

  • 温度等级:该器件为商业温度等级(0℃ ~ +70℃),在更严苛的工业高/低温环境下应选用工业级元件或进行额外的热管理。
  • 质量一致性:选购时建议向供应商索取批次测试报告或质量证书,确保焊接、外观与电性能满足项目要求。
  • 兼容性与替代:在设计替代元件时,确认封装、引脚和电气特性(电源、IO 电平、控制引脚逻辑)的一致性,避免因引脚或功能差异引发系统问题。
  • 资料确认:最终设计与生产前,请以 JSMSEMI 官方技术手册与器件规格书为准,核对引脚定义、电气参数与应用示例。

结语:SN75176BDR 作为一款通用 RS-485/RS-422 差分收发器,以其单通道、5V 供电与 SOP-8 封装的组合,适合多数商业及轻工业串行总线应用。合理的 PCB 布局、终端与偏置设计以及对工作温度与防护的重视,能显著提升系统的可靠性与抗干扰能力。如有具体电气参数、引脚图或应用电路设计需求,建议获取并参照 JSMSEMI 的完整数据手册。

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