Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
JSMSEMI SP3232EEN
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JSMSEMI SP3232EEN
- Type
- JSMSEMI
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JSMSEMI
- Electronic Component
- SP3232EEN
- Electronic Component
- 1
- Package
- SOP-16
- Type
- Transceiver
- Electronic Component
- RS232IC
- Electronic Component
- 0.279g
- Electronic Component
- 1
- Features
- Level Conversion
- Electronic Component
- BM0229961411
- Operating Temperature
- 0℃~+70℃
- Operating Voltage
- 3V~5.5V
- Receiver
- 2
- Data
- 250Kbps
- Static Current
- 0.3mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SP3232EEN 产品概述
一、概述
SP3232EEN 是杰盛微（JSMSEMI）推出的一款双驱动器/双接收器串行收发器，面向TTL/CMOS 与 RS‑232 电平之间的双向转换。器件内置电荷泵，无需外部双电源即可生成 RS‑232 所需的正负电压，适配 3.0V 至 5.5V 的单电源系统，适合嵌入式、工业和消费类串口通信应用。
二、主要规格亮点
- 类型：收发器（Transceiver）
- 驱动器数：2、接收器数：2（2Tx/2Rx）
- 最高数据速率：250 kbps（典型异步串行通信速率）
- 工作电压：3.0V ~ 5.5V 单电源
- 静态电流：0.3 mA（低功耗静态工作）
- 电荷泵：集成（无需外置负电源）
- 静电保护：±8 kV（人体模型，针对 I/O 引脚）
- 工作温度范围：0 ℃ ~ +70 ℃
- 封装：SOP‑16
三、功能特点与优势
- 内置电荷泵：直接由单电源生成 RS‑232 所需的电平范围，简化系统电源设计，降低成本与体积。
- 低静态电流：典型 0.3 mA，适合对功耗敏感的便携与待机场景。
- 宽工作电压：3.0V–5.5V 支持 3.3V 与 5V 系统无缝集成。
- 可靠的静电防护：±8 kV ESD 抗扰能力提高了接口在现场使用的抗损坏率。
- 标准封装：SOP‑16 便于批量组装与生产替换。
四、典型应用场景
- 嵌入式主控板与单片机的 RS‑232 外设接口（调试口、外设通信）
- 工业控制与数据采集（如 PLC、传感器集中器）
- POS 终端、仪表和测试设备的串口通信模块
- 串口调制解调器、串口打印机与其它传统串行外设
五、设计与使用建议
- 电荷泵外部电容：为保证电荷泵稳定，按数据手册推荐布置外部电容并使用低ESR陶瓷电容；具体容值与引脚连接请参照原厂数据手册。
- 去耦与布线：在 VCC 近旁放置 0.1 μF 去耦电容以抑制噪声，RS‑232 信号线走线应考虑阻抗与接地回流路径。
- 接地与屏蔽：在工业或噪声环境中建议做好接地与外壳屏蔽，以提高通信稳定性和抗干扰能力。
- 温度与可靠性：保证工作环境温度在 0 ℃ ~ +70 ℃ 范围内，超出范围时请采用相应等级器件或采取散热/保温措施。
六、封装与订购信息
SP3232EEN 提供 SOP‑16 封装，适用于常规波峰与回流焊工艺。具体封装引脚分配、包装形式与订购编码请参见杰盛微官方资料或向供应商索取产品数据手册与器件样片。
如果需要进一步的电气特性曲线、引脚定义、推荐 PCB 布局或与常见 MCU 的接口示例，我可以基于数据手册为您提供更详细的设计指导。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
