WMSIC Electronic Components

JSMSEMI SS54

ModelSS54
PackageSMA
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI SS54
Type
JSMSEMI
Minimum package
2000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
SS54
Electronic Component
1
Package
SMA
Electronic Component
Schottky Diode
Electronic Component
0.096g
Electronic Component
1
Electronic Component
BM0229961344
Current
5A
Diode
1
Current(Ir)
100uA@40V
(Vf)
550mV@5A
Electronic Component
55℃~+150℃
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS54(JSMSEMI / 杰盛微)产品概述

一、产品简介

SS54 为 SMA 封装的肖特基整流二极管,由 JSMSEMI(杰盛微)生产,适用于中等电流整流与保护场合。器件在小体积下提供较低的正向压降和较高的浪涌承受能力,是开关电源、DC-DC 转换、电池防反接与整流等电路常用元件。

二、主要参数

  • 品牌:JSMSEMI(杰盛微)
  • 封装:SMA(表面贴装)
  • 整流电流(IF):5A(平均)
  • 正向压降(Vf):0.55V @ IF = 5A
  • 直流反向耐压(Vr):40V
  • 反向电流(Ir):100μA @ VR = 40V
  • 非重复峰值浪涌电流(IFSM):100A(单次脉冲)
  • 工作结温范围:-55℃ ~ +150℃

三、器件特性与优势

  • 低正向压降:在高电流工作时,0.55V 的正向压降有助于降低功耗和发热,提升效率。
  • 较高浪涌能力:100A 的单次峰值浪涌能力能承受开机冲击、电流浪涌等瞬态事件。
  • 中等反向耐压:40V 的反向耐压适合 12V、24V 等低压系统的整流与保护应用。
  • 宽温度工作范围:-55℃至+150℃适应工业及汽车级别苛刻环境。

四、典型应用场景

  • 开关电源(SMPS)输出整流
  • DC-DC 转换器的快速整流与续流二极管
  • 电池充电与电源管理的防反接保护
  • 汽车电气系统中的整流与保护(适用于 12V/24V 低压部分)
  • 逆变器、UPS 及工业控制设备中的整流模块

五、封装与热管理建议

  • SMA 封装体积小,散热主要依赖于焊盘和 PCB 铜箔面积。建议在 PCB 下方和引脚周围使用散热槽或加大铜箔面积(热沉)以降低结温。
  • 在满载(5A)长期工作时,应评估器件结温并采用恰当的散热设计,必要时加装风冷或热导垫。
  • 焊接工艺建议遵循器件厂商的回流温度曲线,避免过热导致器件性能退化。若无明确曲线,请参考一般无铅回流标准并以实际试验验证可靠性。

六、使用与选型注意事项

  • 若应用电压或瞬态可能超过 40V,应选择更高 Vr 的器件以保证可靠性。
  • 对于对漏电流敏感的电路场合(例如待机电路),需注意 Ir = 100μA 在 40V 下的泄漏对整体系统的影响。
  • 若期望更低 Vf 或更高电流能力,可考虑同系列更大封装或并联多只器件,但并联需注意均流问题与寄生电感。
  • 在脉冲或频繁浪涌工况下,请核算器件的热循环寿命与机械应力,必要时进行加固或更换为耐冲击能力更高的型号。

七、总结

JSMSEMI(杰盛微)SS54 为一款适用于中低压整流与保护的 SMA 封装肖特基二极管,具备低正向压降、良好浪涌承受能力与宽温区工作特性。适合开关电源、汽车电子与电源保护等多种应用场景。选型时应结合系统电压、漏电容限值、散热条件与浪涌特性综合评估,以确保长期可靠运行。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.