WMSIC Electronic Components

JSMSEMI SXL1509-3.3E1 SXL1509

ModelSXL1509-3.3E1
PackageSOP-8
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI SXL1509-3.3E1
Type
JSMSEMI
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
SXL1509-3.3E1
Electronic Component
1
Package
SOP-8
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.216g
Electronic Component
1
Features
Electronic Component
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0257688695
Operating Temperature
40℃~+125℃
Operating Voltage
4.5V~40V
Switching Frequency
127kHz~173kHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SXL1509-3.3E1 产品概述

一、产品概述

SXL1509-3.3E1 是一款降压型(Buck)开关稳压器,集成高侧开关管,输出固定 3.3V,最大输出电流可达 3A。输入电压范围宽(4.5V ~ 40V),适用于 12V、24V 等典型工业与通信电源母线。该器件为非同步整流结构(需外接肖特基二极管),工作开关频率在 127kHz ~ 173kHz 之间,静态工作电流(Iq)约 10mA,适合需稳压且能接受中等效率折衷的应用场合。封装为 SOP-8,工作温度范围 -40℃~+125℃。

二、主要特性

  • 功能类型:降压型(Buck),固定输出 3.3V;
  • 输入电压:4.5V ~ 40V,适应宽范围母线;
  • 输出电流:最高 3A(需合理散热设计以保证持续输出);
  • 开关频率:127kHz ~ 173kHz,有利于电感与电容的尺寸选择与 EMI 管理;
  • 同步整流:否(需外接低压降肖特基二极管);
  • 静态电流:约 10mA(空载功耗中等);
  • 封装:SOP-8,便于通用 PCB 组装;
  • 工作温度:-40℃~+125℃,适合工业级应用。

三、典型应用

  • 工业控制与通信设备的 3.3V 辅助电源;
  • 24V/12V 母线到 3.3V 的点对点电源转换;
  • 嵌入式系统、传感器节点及供电模块(需评估热设计);
  • 需求宽输入且对成本、零件数有要求的中低功率场合。

四、设计要点与外部元件选择

  • 整流二极管:由于为非同步结构,建议选用低正向压降、高速肖特基二极管,电流额定值应不小于输出电流且耐压高于最大输入电压;
  • 电感:按开关频率与允许电流纹波(通常取 20%~40% Iout)选择电感值与饱和电流等级;电感饱和后会显著影响性能;
  • 输出电容:选用低 ESR 的固态电解或陶瓷电容以降低输出纹波并保证稳定性;输入侧需并联合适的去耦电容抑制感性阻抗与瞬态;
  • PCB 布局:输入电容、开关节点和二极管应尽量靠近器件引脚并缩短回流环路;大面积铜箔有利于散热与功率回流;
  • 保护与滤波:根据系统需要增加输入滤波、浪涌抑制和软启动电路,必要时在输出端增加过流或过温保护措施。

五、封装与热管理

SOP-8 封装便于安装但散热能力有限;在高输入差分(Vin 高且 Vout 低)和大电流工作条件下,器件功耗显著,需通过扩大 PCB 铜箔、增加散热过孔、放置在散热良好的板区等方式提升散热,保证器件结温在安全范围内,以保证长期可靠性。

六、可靠性与使用建议

在设计中应注意器件在高 Vin 与满载工况下的功率损耗、二极管发热与整体系统效率;如需车规级应用或更高效率,建议评估同步整流或更低静态电流的替代方案。使用前请参考 JSMSEMI 官方数据手册以获得完整电气参数、典型应用电路、布线建议及各类保护特性说明。

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