Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
JSMSEMI IR2106STRPBF-JSM IR2106STRPBF
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JSMSEMI IR2106STRPBF-JSM
- Type
- JSMSEMI
- Minimum package
- 2500 未知
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JSMSEMI
- Electronic Component
- IR2106STRPBF-JSM
- Electronic Component
- 1
- Package
- SOP-8
- Electronic Component
- (UVP)
- Electronic Component
- Gate Driver IC
- Electronic Component
- 0.103g
- Electronic Component
- 1
- Electronic Component
- BM0258706477
- Operating Temperature
- 40℃~+125℃
- Operating Voltage
- 10V~20V
- Load Type
- MOSFET；IGBT
- Current(IOH)
- 300mA
- Current(IOL)
- 600mA
- Driver Channel Count
- 2
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
IR2106STRPBF-JSM 产品概述
一、产品概述
IR2106STRPBF-JSM（品牌：JSMSEMI/杰盛微）是一款双通道高低边驱动器，专为驱动功率MOSFET与IGBT等开关器件设计。器件采用SOP-8封装，支持高低侧驱动配置，工作电压范围宽（10V～20V），同时集成欠压保护（UVP），适用于中高压半桥与全桥功率转换场合。
二、主要特性
- 双通道驱动：同时提供高侧与低侧的栅极驱动能力，便于构建半桥/全桥拓扑。
- 驱动能力：灌电流（IOL）600mA，拉电流（IOH）300mA，具备较强的关断吸收能力与适度的开通速度。
- 开关性能：典型下降时间（tf）35ns，有利于减小开关损耗与提升切换性能。
- 保护与低功耗：内置欠压保护（UVP），静态工作电流仅约120μA，适合对待机功耗敏感的系统。
- 广温范围：工作温度范围-40℃～+125℃，适应工业级环境。
三、电气参数要点
- 驱动电压范围：VDDA/VCC等驱动电源可在10V至20V之间选择，保证充分栅极门限余量以驱动各种MOSFET/IGBT。
- 驱动方向性：注意器件拉、灌电流不对称，600mA的灌电流有利于快速关闭器件，300mA的拉电流在开通时需要配合合适的门极电阻以控制dv/dt与电磁干扰。
- 开关时间：35ns的下降时间为参考指标，实际开关速度受寄生电感、电容、门极电阻与负载条件影响。
四、封装与热/环境规格
- 封装形式：SOP-8，便于表面贴装生产与常规散热设计。
- 环境适应：-40℃～+125℃工业级工作温度，适合电机驱动、电源转换等严苛环境。设计时需关注封装导热与PCB散热路径，确保长时间可靠工作。
五、典型应用
- 半桥/全桥逆变器与驱动模块；
- 开关电源（SMPS）和功率因数校正（PFC）前端；
- 电机驱动控制（驱动MOSFET/IGBT）；
- 各类中功率开关转换与负载切换电路。
六、设计注意事项
- 电源去耦：建议在VCC与GND近旁并联低ESR电容与快速旁路电容以抑制瞬态尖峰。
- 门极电阻：根据器件与系统EMI要求选择合适门极电阻（通常10Ω～100Ω范围），平衡开关损耗与过渡应力。
- 引导电容（Bootstrap）：若采用高侧驱动，需配置合适的bootstrap电容与二极管以保证高侧门极供电稳定。
- 热管理：在高频或高负载条件下，注意SOP-8封装的散热限制，可通过铜箔加厚与散热板改善热性能。
- 欠压保护校验：在系统上电/掉电与再起动场景下验证UVP行为，确保栅极未被错误驱动。
七、优势概述
IR2106STRPBF-JSM结合较宽的驱动电压、强劲的关断能力、内置欠压保护与低静态电流，适合需要可靠保护与工业级温度适应性的中等功率驱动场景。SOP-8封装便于标准化生产，是驱动MOSFET/IGBT的实用解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
