WMSIC Electronic Components

JSMSEMI CZT5551-JSM CZT5551

ModelCZT5551-JSM
PackageSOT-223
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI CZT5551-JSM
Type
JSMSEMI
Minimum package
1000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
CZT5551-JSM
Electronic Component
1
Package
SOT-223
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.198g
Electronic Component
1
Electronic Component
BM0259364234
Operating Temperature
65℃~+150℃
Transistor Type
NPN
Frequency(f T)
300MHz
Power Dissipation(Pd)
2W
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CZT5551-JSM 产品概述

一、概述

CZT5551-JSM 是 JSMSEMI(杰盛微)推出的一款高压 NPN 晶体管,采用 SOT-223 表面贴装封装,面向中功率开关与放大场合。器件在设计上兼顾高压耐受与较高直流电流增益,适合需要较大电流驱动能力且占板面积受限的应用。

二、主要参数

  • 晶体管类型:NPN
  • 集电极电流(Ic):600 mA(最大)
  • 集射极击穿电压(Vceo):160 V
  • 耗散功率(Pd):2 W
  • 直流电流增益(hFE):250 @ Ic=10 mA, Vce=5 V
  • 特征频率(fT):300 MHz
  • 集电极截止电流(Icbo):50 mA(标称)
  • 集射极饱和电压(VCE(sat)):≤200 mV @ Ic=50 mA / 5 mA
  • 射基极击穿电压(Vebo):6 V
  • 封装:SOT-223

三、性能特点

  • 高压能力:Vceo 达 160 V,适合高压开关与续流场合。
  • 较大电流容量:600 mA 的集电极电流能力满足中等功率负载驱动需求。
  • 低饱和压降:VCE(sat) 在典型工作电流下可低至 200 mV,有利于降低开关损耗。
  • 高频特性良好:fT=300 MHz,支持较快开关速度与射频前端的小信号增益。
  • 高频直流增益高:在低电流区(10 mA)hFE 可达 250,便于作为放大级器件使用。

四、典型应用

  • 开关电源与次级驱动电路的开关管或保护管。
  • 中小功率电机驱动、继电器驱动及灯控电路。
  • 低频至中高频放大器及前置放大级。
  • 工业控制、家电及通信设备中需要高压耐受与较高增益的场合。

五、使用与注意事项

  • 散热管理:封装为 SOT-223,器件耗散功率 Pd 为 2 W;在实际应用中需保证良好散热(合理铜箔面积或散热片),以避免结温超限导致性能下降。
  • 击穿与偏置:射基极击穿 Vebo=6 V,基极-发射极间正向/反向偏置需在安全范围内控制。
  • 截止电流:标称 Icbo 值较大,设计时应注意漏电流对静态功耗与偏置稳定性的影响,必要时采用旁路或偏置补偿措施。
  • 建议在数据表和应用规范下选择适当的工作点,并进行实际温度与频率下的验证。

六、封装与采购信息

  • 品牌:JSMSEMI(杰盛微)
  • 封装形式:SOT-223,便于表面贴装与散热处理。
  • 描述分类:未分类(请以厂家数据表为准以获取更完整的电气和机械规格)

如需完整电气特性曲线、引脚定义、典型应用电路与封装尺寸图,请提供需求,我可以基于厂家资料为您整理详细的数据手册摘要与推荐电路。

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