WMSIC Electronic Components

JSMSEMI JSM6288T

ModelJSM6288T
PackageTSSOP-20
BrandJSMSEMI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JSMSEMI JSM6288T
Type
JSMSEMI
Minimum package
4000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JSMSEMI
Electronic Component
JSM6288T
Electronic Component
1
Package
TSSOP-20
Electronic Component
(UVP)
Electronic Component
Gate Driver IC
Electronic Component
0.171g
Electronic Component
1
Electronic Component
BM0229961340
Operating Temperature
40℃~+125℃
Operating Voltage
8V~20V
Load Type
MOSFET
Current(IOH)
1.8A
Current(IOL)
1.5A
Driver Channel Count
6

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

JSM6288T 产品概述

一、产品概况

JSM6288T 是杰盛微(JSMSEMI)推出的一款用于驱动功率 MOSFET 的专用驱动器,封装为 TSSOP-20。器件支持低边与高边驱动配置,适配汽车与工业等对耐压、温度及可靠性有较高要求的电源与驱动场景。工作电压范围为 8V ~ 20V,工作温度范围为 -40℃ ~ +125℃,并集成欠压保护(UVP),静态电流仅 230 μA,适合对待机功耗敏感的系统。

二、主要电气参数

  • 驱动类型:低边 / 高边(依系统接法配置)
  • 负载类型:MOSFET
  • 灌电流 IOL(吸电流):1.5 A
  • 拉电流 IOH(源电流):1.8 A
  • 上升/下降时间 tr / tf:30 ns(典型)
  • 工作电压 VCC:8 V ~ 20 V
  • 静态电流 Iq:230 μA
  • 保护功能:欠压保护(UVP)
  • 工作温度:-40℃ ~ +125℃
  • 封装:TSSOP-20

三、功能特点与优势

  • 宽电压范围(8–20V),能直接适配 12V/24V 车载及工业供电系统;
  • 高峰值驱动能力(IOH 1.8A / IOL 1.5A),可高效驱动常见功率 MOSFET,缩短开关时间;
  • 上升/下降时间 30ns,有利于降低开关损耗并提高效率(同时需配合合理阻尼以控制振铃);
  • 极低静态电流(230 μA),满足低待机能耗设计;
  • 集成欠压保护,避免驱动在电源不稳时造成 MOSFET 半导通或异常发热。

四、典型应用场景

  • 汽车电子:车载 DC-DC、电机驱动、车灯控制与继电器替代;
  • 开关电源:同步整流 MOSFET 驱动、功率变换器级联;
  • 工业控制:步进/无刷电机驱动、逆变器与电源管理模块;
  • 大电流开关:电池管理系统、负载开关应用。

五、使用建议与布板要点

  • 电源去耦:VCC 端应在驱动器近旁并加大容量(10 μF + 0.1 μF)以抑制瞬态尖峰;
  • 栅极电阻:建议在驱动引脚与 MOSFET Gate 之间串接合适的栅极电阻(10Ω–100Ω),平衡开关速度与电磁干扰、振铃;
  • 引线与地线:功率回路走线短、粗,驱动地与功率地参考地应合理分割并在一点汇流;
  • 保护元件:在输入侧与负载侧视情况加入 TVS、RC 吸收器或 snubber 降低过压风险;
  • 热管理:TSSOP-20 封装需注意铜箔散热与焊盘设计,长时间大电流切换应评估器件温升并必要时做散热处理。

六、可靠性与测试要点

  • 在高温(125℃)与低温(-40℃)下验证驱动特性与欠压保护动作;
  • 在典型负载条件下测试开关损耗、栅极电压摆幅及对 MOSFET 的驱动一致性;
  • 做瞬态电源跌落与上电斜率测试,确认 UVP 行为与系统稳定性。

七、封装与订购信息

  • 型号:JSM6288T
  • 封装:TSSOP-20
  • 建议在采购与设计阶段向供应商获取最新数据手册、器件管脚图与评价板资料,以便完成电路设计与样机验证。

总结:JSM6288T 以其宽电压、低静态功耗与较高瞬态驱动能力,适合车载及工业级 MOSFET 驱动场景。合理的外部去耦、栅极阻尼与 PCB 布局是发挥其性能与保证系统可靠性的关键。若需更详细的电气特性曲线或参考设计,请参考厂商数据手册或联系供应商工程支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.