WMSIC Electronic Components

JUXING SS24F

ModelSS24F
PackageSMAF
BrandJUXING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JUXING SS24F
Type
JUXING
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JUXING
Electronic Component
SS24F
Electronic Component
1
Package
SMAF
Electronic Component
Schottky Diode
Electronic Component
0.057g
Electronic Component
1
Electronic Component
BM0265601712
Current
2A
Diode
Electronic Component
Current(Ir)
500uA
(Vf)
550mV@2A
Electronic Component
Electronic Component
Electronic Component
3000
Voltage Rating(Vr)
40V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SS24F肖特基二极管产品概述

SS24F是一款独立式表面贴装肖特基整流二极管,由国内知名分立器件厂商钜兴(JUXING)推出,针对低压、高频整流场景优化设计,具备低正向压降、小封装、高可靠性等核心优势,广泛应用于消费电子、电源适配器、LED驱动等领域。

一、产品核心参数与定位

SS24F属于小功率肖特基二极管系列,参数明确适配低压应用需求:

  • 反向耐压:直流反向耐压((V_r))为40V,可满足5V/12V等低压电路的反向阻断要求;
  • 整流电流:额定直流整流电流((I_{f(AV)}))为2A,峰值电流((I_{f(SM)}))支持短期过载(典型值~20A@10ms,需结合电路设计);
  • 正向压降:典型值550mV@2A(肖特基二极管优势显著,远低于传统硅整流管的1V以上);
  • 反向漏电流:最大反向漏电流((I_r))为500μA(额定反向电压下测试,漏电流小,阻断性能稳定);
  • 封装形式:SMAF表面贴装封装,符合工业标准,便于自动化焊接。

二、SMAF封装物理特性

SMAF是针对表面贴装优化的小型封装,具备以下特点:

  1. 尺寸紧凑:符合JEDEC标准(典型尺寸:长4.0mm、宽2.5mm、高~1.5mm),可节省PCB空间,适配高密度电路布局;
  2. 焊接可靠性:引脚采用镀锡铜合金材质,兼容回流焊、波峰焊工艺,焊接强度高(回流焊峰值温度支持260℃/10s);
  3. 环境适应性:封装采用耐高温环氧树脂,抗冲击、耐潮湿,工作温度范围覆盖-55℃~+150℃。

三、电气性能关键优势

作为肖特基二极管,SS24F的核心性能优势体现在:

  1. 低正向压降:550mV@2A的压降可显著降低整流损耗,提升电源转换效率(低压场景下损耗占比更明显);
  2. 快速反向恢复:无反向恢复时间(或极短,<10ns),相比传统硅整流管(μs级恢复时间),大幅降低开关损耗,适配100kHz以上高频开关电源;
  3. 稳定反向特性:40V耐压与500μA漏电流组合,额定电压下反向阻断可靠,避免漏电导致的效率下降或元件损坏。

四、典型应用场景

SS24F的参数与封装特性使其适用于以下场景:

  1. 低压电源适配器:5V/12V手机充电器、平板电源的整流环节;
  2. 小功率开关电源:10W以内电源模块的二次侧整流;
  3. 电池充电电路:移动电源、蓝牙耳机充电仓的防反接或整流;
  4. LED驱动:小功率LED灯带、台灯的直流整流(配合恒流IC);
  5. 消费电子:智能手表、智能家居设备的电源整流模块;
  6. 汽车电子:车载USB、低电压传感器的辅助整流(需确认温度范围)。

五、品牌与可靠性保障

钜兴(JUXING)作为成熟分立器件厂商,SS24F具备完善可靠性:

  • 环保认证:符合RoHS 2.0、REACH标准,无铅焊接兼容;
  • 可靠性测试:通过高低温循环(-55℃~+150℃,1000次)、湿度老化(85℃/85%RH,1000h)、焊接拉力测试;
  • 质量体系:通过ISO 9001认证,产品一致性好,批次差异小。

六、选型与替代参考

若需替代SS24F,需注意封装与参数匹配:

  • 同品牌:JUXING SS24(DO-214AC封装,参数一致);
  • 其他品牌:ON Semiconductor SS24F、Vishay SS24F(SMAF封装,参数兼容);
  • 注意:替代时需确认反向耐压、整流电流与电路需求匹配,避免过载。

SS24F以高性价比、小封装、低损耗等特点,成为低压小功率整流场景的优选器件,可满足多数消费电子与工业辅助电路的需求。

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