WMSIC Electronic Components

JUXING BZT52C15

ModelBZT52C15
PackageSOD-123W
BrandJUXING
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
JUXING BZT52C15
Type
JUXING
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
JUXING
Electronic Component
BZT52C15
Electronic Component
1
Package
SOD-123W
Electronic Component
Zener Diode
Electronic Component
0.033g
Electronic Component
1
(Zzk)
200Ω
(Zzt)
30Ω
Electronic Component
BM0226478993
Diode
1
Power Dissipation(Pd)
500mW
Electronic Component
13.8V~15.6V
Electronic Component
55℃~+150℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BZT52C15 稳压二极管(JUXING 钜兴 · SOD-123W · 500mW)

一、产品概述

BZT52C15 为钜兴(JUXING)生产的独立式稳压二极管,标称稳压值 15V,实际稳压范围 13.8V~15.6V。器件采用小型 SOD-123W 封装,最大耗散功率 500mW,适用于空间受限的表面贴装场合,作为基准电压、并联稳压或浪涌钳位元件使用。工作结温范围宽 (-55℃~+150℃),适应工业级环境。

二、主要电气参数

  • 标称稳压值:15V
  • 稳压范围:13.8V ~ 15.6V
  • 最大耗散功率 Pd:500mW(在规定环境温度和散热条件下)
  • 反向漏电流 Ir:100nA @ 10.5V
  • 阻抗 Zzk:200Ω(说明:Zzk 表示击穿起始段或低电流条件下的动态阻抗)
  • 阻抗 Zzt:30Ω(说明:Zzt 通常为在测试电流下测得的稳态差分阻抗)
  • 工作结温范围:-55℃ ~ +150℃

以上参数为器件典型或最大额定值,具体选用时应参考完整数据手册。

三、封装与机械特性

SOD-123W 封装体积小、引脚短,适合高密度贴装与自动化生产。该封装热阻较小封装更大,热量主要靠 PCB 铜箔扩散,因此在高功率或连续工作时需合理设计散热铜箔与热楔。封装兼容主流回流焊工艺。

四、典型应用场景

  • 低功率并联稳压(作为基准电压源)
  • 电源辅助稳压与电压钳位(浪涌保护)
  • 仪表、传感器与微控制器接口的局部稳压
  • LED 驱动或显示模块的过压保护
  • 消费类与工业控制电子的电源保护电路

五、选型与使用建议

  • 功耗与电流限制:最大耗散功率 500mW,对应器件承受的最大稳压电流 Iz_max ≈ 500mW / 15V ≈ 33mA。建议采取安全裕度(例如 ≤50%),连续工作时将 Iz 控制在约 15mA 左右以降低结温并提高可靠性。
  • 串联限流设计:当用作并联稳压时,串联电阻 R = (Vin - Vz) / (IL + Iz),其中 IL 为负载电流,Iz 为稳压二极管电流(留有裕度)。示例:Vin=24V,Vz=15V,IL=5mA,若取 Iz=10mA,则 R=(24-15)/(5+10)mA=9/15mA=600Ω;此时二极管功耗 Pd=15V×10mA=150mW,安全。
  • 对稳压精度要求:BZT52C15 为普通功率稳压二极管,阻抗与温漂相对较大,不宜用于高精度参考场合。
  • 温度漂移与环境:在高温下器件允许耗散功率会下降,应查阅数据手册中的功耗与温度降额曲线并相应降额设计。

六、可靠性、热管理与焊接注意事项

  • 由于 SOD-123W 封装热阻较高,建议在 PCB 设计中增加散热铜箔面积或热通孔,以利热量扩散。
  • 避免长时间在接近最大耗散功率下工作;若需短时浪涌承受可参考数据手册的峰值浪涌能力。
  • 焊接兼容回流工艺,遵循制造商推荐的回流温度曲线与时间,避免过高温度或重复加热导致性能退化。
  • 存储与装配时注意静电防护(ESD),并避免机械应力作用在引脚与封装上。

七、实例与注意要点

  • 设计时首先按最大输入电压、最大负载电流确认串联电阻及稳压二极管电流范围,核算最大耗散功率并留有余量。
  • 若电路中存在较大瞬态或浪涌,应并联合适的限流或浪涌抑制元件,避免稳压二极管长期受大脉冲应力。
  • 对于要求更低噪声或更小阻抗的场合,可考虑更高功耗或精密参考源代替本型号。

总结:BZT52C15(JUXING,SOD-123W,500mW)为经济型、小封装的 15V 稳压二极管,适合空间受限、功率不大的并联稳压与过压钳位应用。选型时应重点关注功耗限额、结温降额与 PCB 散热设计,以保证长期可靠运行。

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