Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
JDTfuse JFC0603-0500FS JFC0603
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- JDTfuse JFC0603-0500FS
- Type
- JDTFUSE
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- JDTFUSE
- Electronic Component
- JFC0603-0500FS
- Electronic Component
- 1
- Electronic Component
- 0.8mm
- Package
- 0603
- Type
- SMD Fuse
- Electronic Component
- Non-Resettable Fuse
- Electronic Component
- 0.021g
- Electronic Component
- 1.6mm
- Electronic Component
- 0.48mm
- I2t
- 0.001
- Electronic Component
- 1
- Electronic Component
- 50A
- Electronic Component
- BM0264547836
- Operating Temperature
- 55℃~+125℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
JFC0603-0500FS — 0603贴片式熔断器产品概述
一、产品简介
JFC0603-0500FS 为 JDTfuse(集电通) 系列微型贴片熔断器，采用0603封装（尺寸 1.6 × 0.8 × 0.48 mm），额定电流 500 mA、额定电压 32 V，工作温度范围宽 (-55 ℃ ~ +125 ℃)。器件通过 UL 认证，专为消费类电子等对体积、可靠性有严格要求的场合设计，具有品质稳定、性价比高的特点。
二、主要性能与特点
- 小型化封装，适合集成度高的移动与便携设备；
- 额定电流 500 mA，额定电压 32 V，满足常见低压线路保护需求；
- 熔断能量 (I2t) 0.001 A^2s，动作快速、选择性好；
- 分断能力高达 50 A，能在短路时切断较大故障电流，保障下游电路安全；
- 宽温工作范围，适应各种环境温度；
- 通过 UL 认证，品质可靠，适用于量产与商业化应用。
三、电气与机械参数（要点）
- 类型：贴片式慢熔/快熔（根据型号细分）熔断器；
- 额定电流：0.5 A；额定电压：32 V；
- 熔断I2t：0.001 A^2s（典型值，用于选型和熔断能量评估）；
- 最大分断能力：50 A；
- 工作温度：-55 ℃ ~ +125 ℃；
- 尺寸：L 1.6 mm × W 0.8 mm × H 0.48 mm；封装：0603。
四、典型应用
- 智能手机、平板、便携式音视频设备等消费电子产品；
- USB/充电接口过流保护与电源管理模块；
- 可穿戴设备与微型传感器节点的输入保护；
- 电池保护前端及小电流电源轨短路保护。
五、安装与设计注意事项
- 推荐采用标准 SMD 回流焊工艺进行贴装；为保证焊接可靠性，应按器件供应方推荐的回流温度曲线和时间控制焊接参数；
- PCB 布局时避免将高功率发热元件紧邻熔断器，以免影响动作特性；
- 为提高长期可靠性，建议工作电流在额定电流的 80% 以下（视热环境与散热条件调整）；
- 贴装过程注意静电与机械应力控制，避免在装配、测试环节产生冲击或弯折。
六、可靠性与采购信息
JFC0603-0500FS 提供稳定的电气与机械性能，适合批量生产应用。器件已通过 UL 认证，表明其在安全与质量方面满足行业要求。常见包装形式为卷带（Tape & Reel），便于贴片机上料与自动化装配。具体交期、最小订购量与可定制包装，请联系 JDTfuse 或授权分销商获取最新供货信息。
总结：JFC0603-0500FS 以微型化体积、可靠的分断能力与广泛的工作温度范围，为消费类电子及其他对体积和保护性能有要求的应用提供高性价比的过流保护解决方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
