WMSIC Electronic Components

Kingbright APA1606SURCK

ModelAPA1606SURCK
Package0603
BrandKingbright
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
Kingbright APA1606SURCK
Type
KINGBRIGHT
Unit
Electronic Component
Minimum package
2000 圆盘

Technical parameters

Power
75mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KINGBRIGHT
Electronic Component
APA1606SURCK
Electronic Component
1
Package
0603
Electronic Component
630nm
Electronic Component
LEDDiode / LED
Electronic Component
0.036g
Electronic Component
1
LED
220mcd
LED
110°
LED
Electronic Component
Electronic Component
BM0230661272
Electronic Component
645nm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

APA1606SURCK 产品概述

一、产品概况

APA1606SURCK 是 Kingbright 推出的 0603 封装红色 Chip SMD LED,透镜为无色透明,发光颜色为红色(主波长 630 nm,峰值波长 645 nm)。该器件尺寸小、出光均匀、视角宽(110°),适合高密度电路板上的指示与背光场合。

二、电气与光学特性

  • 正向电压 Vf:典型 1.95 V(工作电流 20 mA 时)
  • 额定工作电流 If:20 mA(建议典型驱动)
  • 最大功耗:75 mW(器件最大允许功耗)
  • 发光强度:典型 220 mcd(在 If=20 mA 条件下)
  • 发光角度:110°(宽视角,便于扩散显示)
    上述参数说明:在 20 mA 驱动下器件电功率约 1.95 V × 20 mA ≈ 39 mW,远低于最大功耗 75 mW,但长期工作建议留有余量,避免长期满载。

三、尺寸与封装

封装:0603(约 1.6 mm × 0.8 mm),无色透明透镜,适用于自动贴装与回流焊工艺。小体积有利于高密度布局,但对散热和焊接要求较高。

四、设计与驱动建议

  • 串联电阻计算示例:若以 5 V 作为驱动电压,推荐串联电阻 R = (5 V − 1.95 V) / 20 mA ≈ 150 Ω(采用 150 Ω 或 160 Ω 常规值);若以 3.3 V 驱动,R ≈ 68 Ω。
  • 电阻功耗:以 150 Ω 为例,电阻耗散 P = I^2R = (0.02)^2 × 150 ≈ 0.06 W,采用 1/8 W 以上封装更稳妥。
  • 调光:建议使用 PWM 或恒流驱动器进行亮度控制,PWM 频率选择避免可见闪烁(常用 > 200 Hz)。对于精确亮度一致性,优先采用恒流源驱动。
  • 阵列设计:并联多个 LED 时每颗需单独限流或使用恒流分配,以避免亮度不均或单颗过载。

五、热性能与可靠性

  • 工作温度范围:-40 ℃ ~ +85 ℃,适应大多数工业与消费电子环境。
  • 散热:0603 体积小,连续高电流会导致结温上升,应在 PCB 设计上为焊盘留出适当铜厚与热通道,必要时降低工作电流或采用脉冲驱动以控制结温。
  • 焊接工艺:推荐遵循 Kingbright 的回流焊温度曲线,避免重复高温回流及超时焊接,以免影响光衰与可靠性。
  • ESD 与湿敏:作为半导体光源,需按厂商规定做好 ESD 防护与湿敏处理(MSL)存储与贴装流程。

六、典型应用场景

  • 面板与设备状态指示灯(家电、工业控制、通信设备)
  • 消费电子指示与图形点阵显示(遥控器、手持设备)
  • 背光与装饰光源(仪表、标示灯)
  • 可穿戴与便携设备(需注意电流与热管理)

七、注意事项与采购建议

  • 选型时确认测试条件(发光强度±偏差、测量角度与驱动电流)以保证亮度与颜色一致性。
  • 若对色彩一致性要求高,应参考厂方分档(binning)信息,批次间配色可能有偏差。
  • 生产与维修时遵循厂方封装与回流焊推荐,避免超出最大额定值以延长寿命。
  • 订购时核对包装形式(卷带)与最小订购量,评估放置库存的湿敏等级。

总结:APA1606SURCK 以其微小 0603 封装、清晰红光与宽视角,适合对空间与外观有严格要求的指示与背光应用。合理的电流控制与热管理可以在保证亮度的同时延长使用寿命。若需进一步电气特性曲线或封装尺寸图,建议参照 Kingbright 官方数据手册。

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