WMSIC Electronic Components

KUU DMG1012T-7

ModelDMG1012T-7
PackageSOT-523
BrandKUU
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
KUU DMG1012T-7
Type
KUU
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KUU
Electronic Component
DMG1012T-7
Electronic Component
1
Package
SOT-523
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.025g
Electronic Component
1
Electronic Component
BM0264356209
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
150mW
Gate Voltage(Vgs)
±6V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

DMG1012T-7 产品概述

一、概述

DMG1012T-7 是一颗单通道 N 沟增强型 MOSFET,由 KUU 品牌提供,采用超小型 SOT-523 封装。器件设计用于低压、小电流应用场景,具有较低的导通电阻和较小的功耗,适合便携式设备和精密电源管理电路中作为开关或线性控制元件使用。该器件在紧凑 PCB 布局中能提供可靠的开关性能和稳定的温度范围(-55℃ 到 +150℃)。

二、主要参数

  • 类型:N 沟道 MOSFET(单通道,数量:1)
  • 漏-源电压 Vdss:20 V
  • 连续漏极电流 Id:500 mA
  • 导通电阻 RDS(on):0.7 Ω(700 mΩ)@ Vgs = 4.5 V
  • 最大耗散功率 Pd:150 mW
  • 栅极阈值电压 Vgs(th):0.9 V(900 mV)
  • 总栅极电荷量 Qg:750 pC
  • 栅极最大额定电压 Vgs:±6 V
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOT-523
  • 品牌:KUU

三、特性与优点

  • 小尺寸封装:SOT-523 极小封装利于高密度 PCB 布局,适合体积受限的产品设计。
  • 低压控制:20 V 的耐压范围适合大多数 5 V 及以下系统的负载开关和信号隔离用途。
  • 适度导通电阻:0.7 Ω 在低电流(数百毫安级)下提供合理的导通性能,满足小功率开关要求。
  • 宽温度范围:-55 ℃ 到 +150 ℃ 的工作温度覆盖工业级应用。
  • 易于驱动:阈值电压约 0.9 V,配合 4.5 V 的门级驱动可以达到标称 RDS(on)。

四、典型应用场景

  • 便携式设备的电源开关与负载切换(如智能穿戴、蓝牙模块、便携传感器)。
  • 低电压模拟和数字电路中的信号切换或反向保护。
  • 微控制器驱动的电源断路和电源轨管理(低频切换场合)。
  • 替代机械继电器或作为小功率开关元件以节省空间和提高响应速度。
  • 线性调节或限流场合(注意受功耗限制)。

五、封装与热管理建议

  • 由于 SOT-523 为超小型封装,器件的热阻较大,最大耗散功率 Pd 为 150 mW。在高电流或较高 RDS(on) 条件下,需注意功耗导致的结温升高。
  • 设计 PCB 时建议:
    • 在 MOSFET 的焊盘周围增加铜箔面积作为散热层,必要时与多层板内层铜箔连接以提高散热能力。
    • 保持器件工作点满足 Pd 和 Id 的安全限制,避免长期在耗散功率接近上限的条件下工作。
  • 开关损耗:栅极电荷 Qg 为 750 pC,相对较大,意味着在频繁开关或高频切换应用中会产生较高的驱动能耗和开关损耗,建议将其用于低频或直通(线性)应用,或采用具有足够驱动能力的栅极驱动器。

六、使用注意事项

  • 栅极电压绝对值不超过 ±6 V,超过此值可能导致器件损坏。
  • 工作在接近最大电流(500 mA)或最大功耗(150 mW)时,应对结温进行评估,必要时限制占空比或增加散热措施。
  • 在驱动电路设计时,要考虑 Qg 带来的驱动电流需求,避免因驱动能力不足导致开关速度降低或器件在过渡态停留过久,增加热应力。
  • 建议在设计原型阶段进行热仿真与实测,以确认封装和 PCB 布局能满足长期可靠性要求。

总结:DMG1012T-7 是一款面向低电压、低功耗、体积受限应用的 N 沟道 MOSFET。凭借小体积 SOT-523 封装和工业级温度范围,适用于便携设备与电源管理场合。但受限于较高的栅极电荷和有限的功耗散耗能力,更适合低频开关或静态/线性应用。设计时应充分考虑驱动能力和热管理以确保长期可靠运行。

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