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KUU DSK24 K24
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- KUU DSK24 K24
- Type
- KUU
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- KUU
- Electronic Component
- DSK24 K24
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.038g
- Electronic Component
- 1
- Electronic Component
- BM0264548720
- Current
- 2A
- Diode
- Electronic Component
- Current(Ir)
- 500uA@40V
- (Vf)
- 550mV@2A
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 40V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DSK24 K24 产品概述
一、产品简介
DSK24（K24）为KUU品牌的肖特基势垒二极管，采用SOD-123FL小型表面贴装封装，针对低压高速整流与保护场合优化设计。该器件具有较低的正向压降与快速恢复特性，适用于开关电源、DC-DC转换、整流与反向保护等电力电子应用。
二、主要电气参数
- 正向压降（Vf）：550 mV @ IF = 2 A（常用工作点低压降，降低功耗）
- 直流反向耐压（Vr）：40 V（适用于低压至中低压系统）
- 连续整流电流（IF(AV)）：2 A（在适当散热条件下的额定电流）
- 反向漏电流（Ir）：500 μA @ 40 V（常温条件下的反向泄漏，随温度上升增加）
- 非重复峰值浪涌电流（Ifsm）：40 A（短时浪涌承受能力强，适合抗浪涌场合）
这些参数决定了器件在功率损耗、热管理和开关性能之间的平衡特性。
三、封装与热性能
SOD-123FL为薄型小尺寸封装，便于高密度贴片设计，但单封装散热能力有限。长期2 A工作时需在PCB上提供足够铜箔面积或散热通孔（thermal vias）以降低结温。非重复峰值浪涌40 A为短时事件能力，需避免频繁大幅度过载。
四、典型应用场景
- 开关电源与整流桥的低压输出整流
- DC-DC转换器的输出/钳位二极管
- 电源反向保护与电源OR'ing电路
- 电池充放电路径与便携设备电源路径管理
在需要低正向压降以提高效率、同时容忍一定级别反向漏电的场合，DSK24表现良好。
五、PCB布线与焊接建议
- 在器件焊盘周围预留较大铜箔以增强散热，必要时加热沉铜或过孔连接多层电源平面。
- 避免在靠近高温器件或高电流密度区域狭窄布线，保证热量能有效扩散。
- 按SOD-123FL封装建议的回流焊工艺进行焊接，控制焊接峰值温度与时间以防封装应力。
六、可靠性与选型注意
- 反向漏电流500 μA在高温下会上升，若在高温或高电压待机条件下使用，应评估漏电对系统待机功耗的影响。
- 若系统需承受更高工作电压或更低漏电，应选用更高Vr或低Ir规格的元件。
- 对于频繁高浪涌或连续大电流场合，应关注结温、热阻与器件寿命的退化。
七、结论
DSK24 K24以低正向压降、合理的额定电流与较强的浪涌承受能力，适合多种低压高效整流与保护应用。设计时重点关注热管理与反向漏电对系统的影响，通过合理的PCB散热设计与选型准则可充分发挥该器件的性能优势。
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