WMSIC Electronic Components

kinghelm KH-TYPE-C-24P-T9.87

ModelKH-TYPE-C-24P-T9.87
PackageSMD
Brandkinghelm
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
kinghelm KH-TYPE-C-24P-T9.87
Type
KINGHELM
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KINGHELM
Electronic Component
KH-TYPE-C-24P-T9.87
Electronic Component
1
Package
SMD
Electronic Component
USB Connector
Electronic Component
1.09g
(L)
9.87mm
Electronic Component
1
Electronic Component
USB 3.1
Electronic Component
BM0265398637
Electronic Component
Electronic Component
Operating Temperature
30℃~+80℃
Electronic Component
1
Electronic Component
1

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KH-TYPE-C-24P-T9.87 USB 3.1 Type-C 卧贴连接器产品概述

一、产品核心定位与品牌背景

KH-TYPE-C-24P-T9.87是金航标(kinghelm)推出的全功能Type-C母座连接器,聚焦USB 3.1协议传输与小型化设备的卧贴安装需求,主打高可靠性、易装配与场景兼容性,广泛适配消费电子、便携设备及轻量工业场景的接口设计。金航标作为国内电子连接器领域的专业厂商,其产品以工艺稳定性与成本优势著称,该型号延续了品牌在Type-C系列的成熟设计经验,针对卧贴工艺优化了引脚布局与封装结构,适合对体积、装配效率有要求的终端产品。

二、核心技术参数深度解析

该产品的关键参数直接决定了应用边界,具体解析如下:

  1. 协议与接口:支持USB 3.1 Gen1协议(传输速率5Gbps),兼容USB 2.0(480Mbps),Type-C母座设计实现“正反盲插”,彻底解决传统USB接口的方向困扰;
  2. 触点与端口:24Pin全功能触点,覆盖数据传输(差分信号)、电源供电、接地及CC(Configuration Channel)配置通道,单端口布局满足单设备接口需求;
  3. 电气性能:额定电源电流500mA,适配常规数据传输与小功率充电(如移动电源、蓝牙耳机充电),工作电压遵循USB标准5V;
  4. 安装与封装:卧贴式SMD(表面贴装)封装,无需插件孔,可通过回流焊完成装配,节省PCB垂直空间(低Profile设计);
  5. 环境适应性:工作温度范围-30℃~+80℃,满足低温(北方冬季户外设备)与高温(夏季室内电子设备)环境下的稳定运行。

三、结构设计与工艺优势

该型号针对卧贴应用做了针对性优化,核心优势包括:

  • 低Profile卧贴设计:垂直高度控制在合理范围(适配主流轻薄设备),避免占用PCB背面空间,适合智能手机、智能手表等对体积敏感的产品;
  • 镀金触点防护:触点采用镀金工艺(常规厚度0.5μm以上),提升插拔寿命与抗腐蚀能力,减少信号衰减;
  • 引脚优化布局:SMD引脚采用“短脚+宽间距”设计,降低回流焊时的桥接风险,提升焊接良率;
  • 可选屏蔽结构:部分批次配备金属屏蔽壳,减少电磁干扰(EMI),保证USB 3.1高速传输的稳定性。

四、可靠性与环境验证

产品通过多项可靠性测试,确保实际应用稳定:

  • 插拔寿命:≥10000次,满足消费电子设备的日常使用需求;
  • 温湿度测试:-30℃低温下电气性能无衰减,+80℃高温下无变形、触点氧化;
  • 振动与冲击:符合IEC 60068-2-6振动标准(10-2000Hz,加速度2g),适合车载或便携设备的振动场景;
  • 焊接可靠性:回流焊后引脚无虚焊、脱焊,通过48小时盐雾测试无腐蚀。

五、典型应用场景

KH-TYPE-C-24P-T9.87的设计特点使其适配多类场景:

  1. 消费电子终端:智能手机、平板电脑、移动电源的Type-C充电/数据接口;
  2. 便携智能设备:蓝牙耳机充电盒、智能手表充电器、便携投影仪的信号传输接口;
  3. 轻量工业场景:小型工业控制器、智能传感器的Type-C调试接口(温区覆盖-30~+80℃);
  4. 智能家居设备:智能音箱、智能门锁的充电接口(兼容USB 2.0/3.1设备)。

六、选型与安装注意事项

为确保性能发挥,需注意以下要点:

  • 选型匹配:确认设备需求为“全功能24Pin”(仅充电可选16Pin型号),协议需匹配USB 3.1/2.0;
  • 安装工艺:回流焊温度曲线遵循厂商建议(峰值245±5℃,时间≤30秒),避免高温损坏连接器;
  • 维护建议:避免接口进灰尘、液体,定期用干燥棉签清洁触点,防止插拔阻力增大;
  • 静电防护:生产过程中佩戴静电手环,避免静电损坏触点。

该产品凭借紧凑设计、稳定性能与高兼容性,成为Type-C接口终端的优选解决方案之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.