WMSIC Electronic Components

kinghelm KH-CL1.0-H2.5-12PS-SMT

ModelKH-CL1.0-H2.5-12PS-SMT
PackageSMD, P=1mm
Brandkinghelm
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
kinghelm KH-CL1.0-H2.5-12PS-SMT
Type
KINGHELM
Minimum package
1500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KINGHELM
Electronic Component
KH-CL1.0-H2.5-12PS-SMT
Electronic Component
1
Package
SMD, P=1mm
Electronic Component
FFC / FPC Connector
Electronic Component
1.08g
Electronic Component
1mm
Electronic Component
1
Electronic Component
BM0264862409
Electronic Component
Electronic Component
Operating Temperature
25℃~+85℃
Electronic Component
2.5mm
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
12P

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KH-CL1.0-H2.5-12PS-SMT 产品概述

一、产品简介

KH-CL1.0-H2.5-12PS-SMT 为 kinghelm(金航标)推出的一款低背高可靠性的 FFC/FPC 连接器。采用抽屉式(滑入式)锁定结构,上接触点设计,12P,间距 P=1.0mm,专为薄型柔性排线与表贴 PCB 连接场景设计,适用于工业控制、消费电子及便携设备等对体积与可靠性有要求的应用。

二、主要参数

  • 触点数量:12P
  • 间距:1.0mm
  • 锁定特性:抽屉式(滑入锁定)
  • 触点类型:上接(从上方插入 FFC/FPC)
  • 安装方式:卧贴(低背 SMD)
  • 板上高度:2.5mm
  • 适配柔性电缆厚度:0.3mm
  • 触头材质:磷青铜
  • 触头镀层:锡(防氧化、易焊接)
  • 工作温度范围:-25℃ ~ +85℃
  • 额定电压:50V
  • 封装形式:SMD

三、结构与材质优势

触点采用磷青铜材质,配以锡镀层,兼顾导电性与成本控制;上接触点设计使排线插拔方向直观且装配简便。抽屉式锁定提供稳定的机械约束,插入后卡位可靠,减少接触失效风险。卧贴 SMD 封装降低了组件的整体高度(板上高度 2.5mm),便于在空间受限的产品中集成。

四、电气与环境特性

该连接器额定电压 50V,适用于低压信号及电源传输。适应工作温度范围从 -25℃ 到 +85℃,可满足一般室温及轻度工业环境下的工作需求。触点锡镀层提高了焊接可靠性和抗氧化能力,有利于回流焊工艺的兼容性。

五、应用建议

  • 便携设备:平板、掌上终端、智能穿戴等对尺寸和厚度敏感的产品;
  • 消费电子:显示模组、触控板与主板之间的柔性排线连接;
  • 工业设备:人机界面(HMI)、测控模块等需要可靠信号连接的位置。

六、装配与注意事项

  • 建议采用标准 SMT 回流焊工艺,注意回流曲线与基板材料匹配;
  • 插入柔性排线时请确认厚度为 0.3mm,以保证接触可靠;
  • 抽屉式锁定动作应完整卡入以避免接触跳脱;
  • 建议在使用前做好 ESD 防护,避免触点在装配时发生静电损伤;
  • 对于清洗与长期使用环境,建议提前验证锡镀层在目标清洗溶剂和温湿度下的稳定性。

七、包装与订购信息

产品以 SMD 卷带或托盘方式封装,便于 SMT 线自动贴装。订购时请注明型号:KH-CL1.0-H2.5-12PS-SMT,并确认所需包装形式与最小起订量。

KH-CL1.0-H2.5-12PS-SMT 凭借低背设计、可靠的抽屉式锁定和符合工艺要求的材料选择,适合对体积、装配效率与连接可靠性有综合要求的电子产品。若需更详细的尺寸图、电气性能测试或回流曲线建议,可提供进一步资料支持。

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