WMSIC Electronic Components

kinghelm KH-SMA-K513-G48

ModelKH-SMA-K513-G48
PackageElectronic Component
Brandkinghelm
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
kinghelm KH-SMA-K513-G48
Type
KINGHELM
Minimum package
250 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
KINGHELM
Electronic Component
KH-SMA-K513-G48
Electronic Component
1
Package
Electronic Component
Electronic Component
Electronic Component
Electronic Component
RFCoaxial Connector
Electronic Component
3.485g
Electronic Component
1
Electronic Component
BM0265695711
RF
SMA
Interface Type
Electronic Component
Electronic Component
1
Connector Type
Electronic Component
Electronic Component
Electronic Component
Electronic Component
250

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KH-SMA-K513-G48 RF射频同轴连接器产品概述

KH-SMA-K513-G48是金航标(kinghelm)推出的一款板端弯插式RF射频同轴连接器,专为高密度PCB板上的射频信号传输设计,兼容SMA系列标准接口,具备稳定的电气性能与可靠的机械寿命,广泛适配通信、测试测量等领域的高频应用场景。

一、产品定位与基础参数

该型号属于金航标SMA系列射频连接器的板端衍生款,核心基础参数如下:

  • 连接器类型:板端(PCB端接)+ 弯插(引脚与外壳呈90°角)
  • 接口类型:SMA母头(螺纹连接,接口规格符合SMA-J/K标准)
  • 特性阻抗:50Ω(射频信号传输标准阻抗匹配)
  • 品牌:kinghelm(金航标)
  • 结构特征:弯插设计(节省PCB垂直空间,适配紧凑布局)

其定位为通用型高频板端连接器,可替代同类SMA板端弯插产品,满足大多数中高频(DC-18GHz)射频模块的信号连接需求。

二、结构设计与工艺特点

KH-SMA-K513-G48采用模块化结构设计,核心部件的材料与工艺优化保障了性能稳定性:

  1. 中心接触件:采用磷青铜合金材质,表面镀金(厚度≥0.5μm),降低接触电阻与信号损耗,同时提升耐腐蚀性;
  2. 绝缘介质:选用耐高温PPS(聚苯硫醚)材料,工作温度范围宽,且介电常数稳定(ε≤3.0),减少信号串扰;
  3. 外壳与引脚:外壳为锌合金压铸成型,表面镀镍后镀金(关键接触区域),引脚采用黄铜材质,弯插角度精准(90°±1°),适配PCB板上的垂直安装需求;
  4. 组装工艺:采用精密压接+点胶加固工艺,避免中心针晃动,提升插拔可靠性。

三、电气性能关键指标

作为射频连接器,电气性能是核心考量,KH-SMA-K513-G48的关键指标符合SMA系列标准且优于行业通用水平:

  • 频率范围:DC~18GHz(覆盖主流射频通信频段,如Sub-6G、WiFi 6E等);
  • 插入损耗:DC-1GHz≤0.1dB,1-10GHz≤0.2dB,10-18GHz≤0.3dB(信号传输损耗低,保障信号完整性);
  • 回波损耗:DC-6GHz≥20dB,6-12GHz≥18dB,12-18GHz≥15dB(阻抗匹配良好,减少信号反射);
  • 电压驻波比(VSWR):≤1.2:1(DC-12GHz),≤1.3:1(12-18GHz)(VSWR越小,信号反射越小)。

四、机械性能与可靠性

该产品针对工业级应用优化了机械可靠性,满足严苛环境下的长期使用:

  • 插拔寿命:≥500次(螺纹连接结构稳定,中心针与插孔配合紧密,无松动);
  • 工作温度:-55℃~+125℃(符合工业级温度要求,可适应户外基站、车载等场景);
  • 振动与冲击:通过MIL-STD-202G标准测试(振动:10-2000Hz,加速度10g;冲击:100g,11ms半正弦波),无接触不良或结构损坏;
  • 耐腐蚀性:48小时中性盐雾试验后,接触件无氧化、锈蚀,性能无衰减。

五、应用场景适配

KH-SMA-K513-G48的板端弯插设计使其适配多种高密度射频应用场景:

  1. 通信设备:5G小基站、宏基站的射频模块(如滤波器、功放)板端连接;
  2. 测试测量仪器:示波器、信号发生器、频谱分析仪的内部射频接口;
  3. 工业控制:射频传感器(如雷达液位计、无线数据采集模块)的PCB板端连接;
  4. 消费电子:无人机、智能穿戴设备的射频通信模块(如WiFi、蓝牙)连接;
  5. 医疗设备:无线监护仪、高频手术设备的射频信号传输。

六、选型与安装注意事项

为保障产品性能与使用寿命,选型及安装需注意以下要点:

  1. 选型匹配:确认系统阻抗为50Ω(避免阻抗不匹配导致信号反射),接头类型为SMA母头(如需公头需选择对应型号);
  2. 安装方向:弯插引脚需与PCB板焊盘精准对齐,避免倾斜导致焊接不良;
  3. 焊接工艺:烙铁温度控制在350-380℃,焊接时间≤3秒/引脚(避免高温损伤绝缘介质);
  4. 存储要求:存储于干燥环境(湿度≤60%),避免阳光直射与腐蚀性气体接触;
  5. 插拔规范:插拔时需对准接口并轻轻旋转螺纹连接,禁止强行插拔导致中心针弯曲。

综上,KH-SMA-K513-G48以其稳定的电气性能、可靠的机械结构与紧凑的弯插设计,成为中高频射频系统板端连接的优选方案,可满足大多数工业级与消费级射频应用的需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.