WMSIC Electronic Components

kinghelm KH-AF90DIP-112

ModelKH-AF90DIP-112
PackageElectronic Component
Brandkinghelm
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
kinghelm KH-AF90DIP-112
Type
KINGHELM
Minimum package
100 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KINGHELM
Electronic Component
KH-AF90DIP-112
Electronic Component
1
Package
Electronic Component
Electronic Component
USB Connector
Electronic Component
1.71g
(L)
14.5mm
Electronic Component
1
Electronic Component
USB 2.0
Electronic Component
BM0264862402
Electronic Component
Electronic Component
Electronic Component
1
Electronic Component
4P
Connector Type
Type-A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

KH-AF90DIP-112 USB 2.0 Type-A弯插母座产品概述

一、产品核心定位与基础参数

KH-AF90DIP-112是金航标(kinghelm)推出的通用型USB2.0接口连接器,针对中低端电子设备的基础数据传输与供电需求设计,采用90°弯插插件式结构,核心参数清晰明确:

  • 连接器类型:USB Type-A母座(适配标准Type-A公头)
  • 协议标准:USB 2.0(向下兼容USB 1.1)
  • 触点配置:4Pin(电源VCC+、GND、D+、D-)
  • 端口数量:单端口
  • 安装方式:90°弯插(垂直于PCB布局)
  • 封装形式:DIP插件(手工/波峰焊兼容)
  • 品牌:kinghelm(金航标)

二、关键性能特性解析

2.1 电气性能稳定可靠

严格遵循USB 2.0协议规范,支持三种传输速率(High Speed 480Mbps、Full Speed 12Mbps、Low Speed 1.5Mbps),满足日常数据传输需求:

  • 接触电阻≤20mΩ:降低信号损耗,保证高速传输无卡顿;
  • 绝缘电阻≥100MΩ:相邻触点绝缘性能优异,避免短路风险;
  • 耐压能力:AC 500V(50/60Hz)1分钟不击穿、无飞弧;
  • 电流承载:最大支持2A(可满足多数USB供电设备需求,如小功率外设)。

2.2 机械性能耐用性突出

针对长期插拔场景优化,机械寿命远超行业常规水平:

  • 插拔寿命≥5000次:是普通USB接口的1.2倍以上,适合频繁拔插的设备;
  • 触点材料:优质磷青铜(导电好、弹性持久,避免长期使用后松动);
  • 外壳材质:耐高温工程塑料(LCP/PA66,抗冲击、耐老化);
  • 弯插角度:90°垂直布局,节省PCB水平空间,适配小型化设备。

2.3 环境适应性覆盖广

满足工业级与消费级设备的环境需求:

  • 工作温度:-40℃~+85℃(适应低温户外、高温室内场景);
  • 存储温度:-55℃~+125℃(极端环境下仍保持性能稳定);
  • 湿度耐受:95%RH(40℃)(适合潮湿地区或部分户外安装);
  • 环保认证:符合RoHS 2.0标准(无铅、无镉等有害物质)。

三、设计与工艺优势

3.1 空间优化的弯插结构

90°弯插设计让USB接口可垂直于PCB安装,无需占用水平方向空间,特别适合小型化设备(如迷你路由器、便携式音箱)的内部布局,避免与其他元器件冲突。

3.2 插件式焊接易操作

采用DIP插件封装,相比贴片式(SMT)更适合:

  • 小批量生产、原型开发(降低设备成本);
  • 手工焊接(无需回流焊设备,DIY爱好者友好);
  • 维修场景(插件引脚易拆卸更换)。

3.3 触点与外壳的双重防护

  • 触点表面:镀金/镀锡处理(增强抗腐蚀能力,延长寿命);
  • 外壳边缘:倒角设计(插拔USB公头更顺畅,减少卡壳风险);
  • 引脚间距:标准0.8mm(匹配常规PCB插件孔位,无需定制)。

四、典型应用场景

KH-AF90DIP-112作为通用型USB母座,广泛覆盖以下领域:

  1. 消费电子:智能音箱、网络机顶盒、迷你路由器、便携式充电宝(输入/输出接口);
  2. 办公设备:小型打印机、扫描仪、键盘/鼠标接收器(辅助USB接口);
  3. 工业控制:小型PLC、传感器节点、工业显示器(调试用USB接口);
  4. 智能家居:智能网关、WiFi摄像头、智能门锁(备用供电/数据接口);
  5. DIY开发:Arduino、树莓派等开发板的扩展USB接口。

五、安装与兼容性说明

5.1 安装注意事项

  • 焊接温度:手工焊350℃370℃(≤3秒),波峰焊260℃±5℃(35秒);
  • PCB设计:预留0.8mm~1.0mm插件孔,孔距匹配连接器引脚(通常2.54mm间距);
  • 焊接后:清洗助焊剂残留,避免腐蚀触点。

5.2 兼容性说明

  • 完全兼容USB 2.0 Type-A公头设备(U盘、鼠标、数据线等);
  • 向下兼容USB 1.1设备(实现12Mbps速率传输);
  • 电源兼容:支持5V电压,最大2A电流(需匹配设备供电能力)。

总结

KH-AF90DIP-112以高性价比、稳定可靠、易安装为核心优势,适配多种电子设备的USB接口需求,是消费电子、工业控制、DIY开发等领域的实用选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.