WMSIC Electronic Components

KOA RK73H1ETTP9101D

ModelRK73H1ETTP9101D
Package0402
BrandKOA
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
KOA RK73H1ETTP9101D
Type
KOA
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
KOA
Electronic Component
RK73H1ETTP9101D
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±0.5%
Electronic Component
0.011g
Electronic Component
9.1kΩ
Electronic Component
1
Electronic Component
BM0263492566
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

RK73H1ETTP9101D 厚膜贴片电阻产品概述

RK73H1ETTP9101D是日本KOA公司推出的一款0402封装厚膜贴片电阻,针对高密度、高精度、宽温适应性的电路设计需求开发,兼具小体积与稳定性能,广泛适用于消费电子、工业控制、通信等领域。

一、产品核心定位与基础属性

该电阻属于KOA厚膜电阻系列中的高精度分支,核心定位为小体积高可靠通用型电阻,基础属性明确:

  • 类型:厚膜贴片电阻(采用丝网印刷+烧结工艺制造)
  • 品牌:KOA(日本老牌电子元器件厂商,专注电阻/电容等无源器件60余年)
  • 封装:0402(英制)/1005(公制),尺寸约1.0mm×0.5mm,适配高密度PCB布局
  • 阻值编码:9101(前三位为有效数字910,第四位为倍率10¹,即910×10¹=9.1kΩ)

二、关键参数详解

1. 阻值与精度

  • 标称阻值:9.1kΩ(9100Ω)
  • 精度等级:±0.5%(实际阻值偏差范围为8994.5Ω~9205.5Ω) 该精度满足中高端电路的阻值稳定性要求,如信号放大电路偏置电阻、ADC/DAC分压网络等,无需额外校准即可保证电路性能一致性。

2. 功率与电压额定值

  • 额定功率:100mW(0.1W)
  • 最大工作电压:50V 需降额使用:25℃额定温度下,实际电压需满足“电压²/阻值 ≤ 100mW”(即最大电压≈30.2V);环境温度每升高1℃,功率需降低0.4mW;50V为“电压限制值”(无论功率,电压不得超过)。

3. 温度特性(TCR)

  • 温度系数:±100ppm/℃(每变化1℃,阻值变化为标称值的±100×10⁻⁶) 举例:温度从25℃升至125℃(变化100℃),阻值变化量为91Ω,相对变化率1%,设计时需预留温漂补偿空间。

4. 工作温度范围

  • 存储/工作温度:-55℃+155℃ 覆盖工业级全温区,可适应户外设备、高温车间等极端环境(一般工业温区为-40℃+85℃,汽车级为-40℃~+150℃,该电阻可兼容)。

三、封装与制造工艺优势

1. 0402小封装适配高密度设计

相比0603封装体积缩小约60%,适合智能手机、智能穿戴、微型传感器等对PCB面积要求严格的产品,显著提升电路集成度。

2. 厚膜工艺的可靠性保障

采用陶瓷基板+RuO₂厚膜浆料印刷烧结而成,相比薄膜电阻:

  • 成本更低,适合批量应用;
  • 耐过载能力更强(可承受短时间过功率冲击);
  • 长期稳定性好(1000小时老化后阻值变化≤0.1%),符合IEC 60115-1标准。

四、典型应用场景

1. 便携式电子设备

  • 应用:智能手机信号调理电路、智能手表传感器分压电阻、蓝牙耳机电源滤波网络
  • 适配点:小体积满足轻薄化需求;±0.5%精度保证信号传输准确性。

2. 工业控制模块

  • 应用:PLC输入输出接口电阻、温度传感器信号放大电路、电机驱动限流电阻
  • 适配点:宽温区适应工业现场温差;100mW功率满足小功率控制需求。

3. 通信设备

  • 应用:基站射频模块偏置电阻、路由器ADC分压网络、光纤收发器信号衰减电阻
  • 适配点:高精度保证信号线性度;厚膜工艺低噪声(≤0.1μV/√Hz)适合射频场景。

4. 汽车电子(非极端工况)

  • 应用:车载中控按键电路、倒车雷达信号处理电阻、车载充电器限流电阻
  • 适配点:宽温区覆盖汽车一般工况;部分批次符合AEC-Q200汽车级标准。

五、选型与使用注意事项

  1. 功率降额:环境温度≥85℃时,功率需降额至50%(50mW),避免过热老化;
  2. 焊接工艺:采用回流焊(预热150180℃,峰值230250℃),禁止手工焊接(易虚焊/损坏封装);
  3. 静电防护:遵循ESD规范(HBM≤2kV),避免静电击穿;
  4. 批次一致性:KOA批次一致性好(阻值偏差≤0.5%),批量采购建议整批次使用。

六、总结

RK73H1ETTP9101D凭借小体积、高精度、宽温适应性与KOA可靠品质,成为中高端电路优选无源器件,尤其适合便携式、工业、通信领域。其参数平衡性能与成本,无需为极端性能额外付费,可满足大多数通用电路需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.