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KOA RK73H1JTTD8250F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- KOA RK73H1JTTD8250F
- Type
- KOA
- Unit
- Electronic Component
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- KOA
- Electronic Component
- RK73H1JTTD8250F
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.023g
- Electronic Component
- 825Ω
- Electronic Component
- 1
- Electronic Component
- BM0264794581
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 75V
- Electronic Component
- ±100ppm/℃
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RK73H1JTTD8250F 厚膜贴片电阻产品概述
RK73H1JTTD8250F是日本KOA公司推出的一款0603封装厚膜贴片电阻，专为高密度、宽温环境下的电子电路设计，兼顾精度稳定与成本控制，广泛应用于消费电子、工业控制及通信设备等领域。
一、核心参数与产品定位
该电阻的技术参数精准匹配中小功率电路需求，核心指标如下：
- 阻值与精度：固定阻值825Ω，精度±1%（J档），满足多数电路的精准度要求；
- 功率与电压：额定功率125mW，最大工作电压75V，适配低功耗电路；
- 温度特性：温度系数±100ppm/℃，工作温度范围-55℃~+155℃，覆盖工业级环境；
- 封装规格：0603（公制1608，尺寸1.6mm×0.8mm），体积小巧，适合高密度PCB设计。
其定位为高性价比厚膜贴片电阻，兼顾性能与批量应用的成本优势，是常规电路中替代传统插件电阻的理想选择。
二、材料与工艺特点
作为厚膜电阻，RK73H1JTTD8250F采用KOA成熟的丝网印刷+高温烧结工艺，核心优势包括：
- 浆料配方优化：自研厚膜电阻浆料，确保阻值均匀性与长期稳定性，减少批次间差异；
- 烧结控制：精确的烧结温度曲线（约850℃），使电阻膜层与陶瓷基底结合牢固，降低阻值漂移风险；
- 封装可靠性：陶瓷基底+金属电极结构，抗机械应力能力强，适配回流焊、波峰焊等自动化生产工艺。
三、典型应用场景
结合参数特性，该电阻主要应用于以下场景：
- 消费电子：手机、平板电脑的信号滤波、电压分压电路（低功耗、小尺寸需求）；
- 工业控制：PLC输入输出接口、小型传感器（温度/压力）的信号调理电路（宽温环境适配）；
- 通信设备：基站射频前端辅助偏置电路、光纤收发器电源分压（低寄生参数优势）；
- 车载辅助电路：车载显示屏背光控制、小功率传感器接口（-55℃~+155℃宽温覆盖）。
四、可靠性与环境适应性
- 宽温稳定性：±100ppm/℃的温度系数，在155℃高温下阻值漂移约1.5%，满足工业级环境要求；
- 耐老化性：厚膜电阻膜层不易氧化，经1000小时高温负载测试，阻值变化率小于0.5%；
- 抗干扰性：0603封装的低寄生电感（nH级）与电容（pF级），适合100MHz以下高频电路。
五、使用注意事项
为确保性能稳定，需注意以下要点：
- 功率降额：实际功耗建议不超过额定功率的50%（≤62.5mW），避免过热漂移；
- 电压限制：最大工作电压75V为绝对上限，超压可能击穿电阻膜层；
- 焊接工艺：回流焊峰值温度≤260℃（持续≤10秒），波峰焊温度≤245℃（持续≤5秒）；
- 存储条件：常温干燥环境（25℃±5℃，湿度≤60%），开封后1个月内使用完毕，避免受潮。
RK73H1JTTD8250F凭借稳定的性能、小巧封装及宽温适应性，成为中小功率电路中厚膜贴片电阻的可靠选择，适合对成本与性能平衡要求较高的批量应用场景。
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