Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
KEC 2N5551S-RTK/P
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- KEC 2N5551S-RTK/P
- Type
- KEC
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- KEC
- Electronic Component
- 2N5551S-RTK/P
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 NPN
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.03g
- Electronic Component
- 1
- Electronic Component
- BM69415878
- Transistor Type
- NPN
- Frequency(f T)
- 300MHz
- Power Dissipation(Pd)
- 350mW
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
2N5551S-RTK/P 产品概述
一、产品简介
2N5551S-RTK/P 是一款高性能的NPN型双极性晶体管（BJT），封装形式为SOT-23，适用于各种电子电路中的开关和放大应用。该器件由知名半导体制造商KEC出品，凭借其优异的电气性能和可靠性，广泛应用于消费电子、自动化控制、通信设备等领域。
二、关键特性
- 类型: NPN
- 最大集电极电流 (Ic): 600 mA
- 最大集电极-发射极电压 (Vce): 160 V
- 最大功耗 (Ptot): 350 mW
- 电流增益 (hFE): 在10 mA集电极电流下的直流电流增益为80
- 封装形式: SOT-23
- 工作温度范围: -55°C 至 +150°C
三、应用领域
2N5551S-RTK/P三极管因其高集电极电流能力和高电压耐受性，适合应用于多种场景，包括但不限于：
开关电路: 其600 mA的集电极电流使之理想用于驱动继电器、LED灯以及其他负载，在自动化和家居智能场景中尤为常见。
信号放大: 优良的电流增益特性使其能够有效放大小信号，适用于音频放大器、传感器信号处理模块等应用。
高压应用: 最大集电极-发射极电压为160 V，使其能够在高压环境下工作，满足一些特定电源电路的需求。
四、设计考虑
在设计原理图和PCB时，应考虑以下几个方面：
热管理: 虽然该器件的最大功耗为350 mW，但在设计时需合理布局散热，以避免过热导致性能下降或损坏。
偏置和保护电路: 建议在应用中设计合适的偏置电路，以实现最佳工作状态。同时可以添加过流保护和过压保护电路，以提高电路可靠性。
输入信号特性: 对于放大应用，输入信号的特性对于增益和线性度至关重要。应根据负载和信号源特性进行相应调整。
五、典型应用电路
开关电路示例: 在一简单的LED驱动电路中，通过一个控制信号（如来自微控制器的GPIO口）来控制2N5551S-RTK/P的基极电流，从而实现对LED的开关控制。
放大电路示例: 在一个简单的共发射极放大器中，2N5551S-RTK/P可用作信号增益器件，通过适当选择基极电阻和集电极负载来设置所需的增益。
六、总结
2N5551S-RTK/P 是一款多功能、高性能的NPN晶体管，凭借其600 mA的集电极电流能力和160 V的耐压性能，在电子电路设计中提供了广泛的应用可能。无论是用于开关控制还是信号放大，其出色的电流增益和可靠性均使其成为设计工程师的首选元器件之一。在实际应用中，合理的设计将能够充分发挥其性能优势，在多个行业领域中实现更高的电路效率和可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
