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LRC EFM104
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC EFM104
- Type
- LRC
- Minimum package
- 7500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LRC
- Electronic Component
- EFM104
- Electronic Component
- 1
- Package
- SMA
- Electronic Component
- General Purpose Diode
- Electronic Component
- 0.075g
- Electronic Component
- 1
- Electronic Component
- BM0001776079
- Current
- 1A
- Diode
- 1
- Current(Ir)
- 5uA
- (Vf)
- 950mV
- Electronic Component
- 50℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 7500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
EFM104 整流二极管产品概述
一、产品概述
EFM104 为 LRC（乐山无线电）出品的硅整流二极管，采用 SMA（DO-214AC）表面贴装封装，面向通用整流与保护场景。器件设计可靠、耐压高、峰值浪涌能力良好，适用于开关电源、适配器、整流桥、电源滤波及功率管理等应用。
二、主要参数
- 工作结温范围：-50℃ ~ +150℃
- 正向压降 (Vf)：约 0.95 V
- 非重复峰值浪涌电流 (Ifsm)：30 A
- 直流反向耐压 (Vr)：200 V
- 反向电流 (Ir)：约 5 μA
- 额定整流电流：1 A
- 封装：SMA（表面贴装）
三、主要特性与优势
- 高耐压：200 V 反向耐压适合中高电压整流场景，能应对较大电压应力。
- 低正向压降：典型 Vf ≈ 0.95 V，降低整流损耗，有利于提高系统效率并减少发热。
- 良好浪涌承受能力：30 A 非重复峰值浪涌电流，能在开机、充电或短时突发负载时承受冲击电流。
- 宽工作温度：-50℃~+150℃，适应工业级环境与高温工作场景。
- 小封装、易于自动化贴装：SMA 封装兼顾散热与 PCB 布局，适用于空间受限的设计。
四、典型应用
- 开关电源（SMPS）输出整流与续流二极管
- 小型电源适配器与充电器整流
- 桥式整流模块与离散整流电路
- 逆极性保护、电机驱动续流与抑制尖峰
- 工业控制、仪器仪表及车用电子（需按车规验证）
五、封装与热管理
SMA 封装体积小，但由于额定整流电流为 1 A，长期工作时需关注 PCB 散热设计：
- 使用宽铜箔散热铺铜、增加散热过孔以降低结壳温升。
- 在高平均功耗场合考虑并联多只或选用更大封装/更高电流等级器件。
- 回流焊时遵循厂家建议的温度曲线以保证焊接可靠性。
六、使用与选型建议
- 若工作环境或平均电流接近或超过 1 A，应留足余量或选用更高电流器件。
- 对于要求更低正向压降或更低漏电流的场合，建议比较肖特基二极管或低 Vf 型号，但需注意其反向耐压与温度特性差异。
- 在需要频繁承受冲击电流的应用，关注 Ifsm 与脉冲宽度条件，避免反复超限导致失效。
- 设计 PCB 时保证良好焊盘接触与散热路径，避免局部过热影响寿命。
七、可靠性与注意事项
- 器件在长期高温或高电流应力下会加速老化，应遵循额定值及温度限制使用。
- 储存与贴装时避免潮湿环境，若为防潮包装打开后需按规范回流焊处理或回潮烘干。
- 典型测试条件（如 Vf、Ir）可能依测试电流/温度不同而变化，最终选型请参照 LRC 官方数据表与样片测试结果。
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