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LRC LBAS516T1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- LRC LBAS516T1G
- Type
- LRC
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LRC
- Electronic Component
- LBAS516T1G
- Electronic Component
- 1
- Package
- SOD-523
- Electronic Component
- Switch Diode
- Electronic Component
- 1g
- Electronic Component
- 1
- Electronic Component
- BM0226539075
- Current
- 250mA
- Diode
- Electronic Component
- Power Dissipation(Pd)
- 500mW
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
- Voltage Rating(Vr)
- 75V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LBAS516T1G 产品概述
一、产品简介
LBAS516T1G 是乐山无线电（LRC）生产的一款独立式开关二极管，采用 SOD-523 微型封装，适合空间受限的表贴电路。该器件针对高速开关与小信号整流设计，具有较低的正向压降与快速恢复特性，适用于便携式设备和高频开关环境。
二、主要参数
- 正向压降 (Vf)：约 715 mV（在典型工作电流下）
- 直流反向耐压 (Vr)：75 V
- 连续正向整流电流：250 mA
- 非重复峰值浪涌电流 (Ifsm)：4 A
- 耗散功率 (Pd)：500 mW
- 反向电流 (Ir)：30 nA（常温下）
- 反向恢复时间 (Trr)：约 4 ns
- 封装：SOD-523（微型表贴）
三、产品特性
- 低正向压降，有利于降低导通损耗与发热。
- 极短的反向恢复时间（4 ns），适合高频开关和脉冲应用，减少开关损耗和电磁干扰。
- 极低反向漏电流（30 nA），适合对泄漏敏感的低功耗电路。
- 微型 SOD-523 封装，节省 PCB 面积，适合密集布局和小型化产品。
- 良好的抗浪涌能力（Ifsm 4 A），在短时冲击场合具备一定容错能力。
四、典型应用场景
- 开关电源次级整流与同步补偿。
- 高频脉冲信号整形与钳位电路。
- 手机、便携式音视频设备与穿戴式电子产品的小电流整流或保护。
- LED 驱动与指示灯电路中的小信号整流。
- 通信用的收发前端保护与开关矩阵。
五、封装与热管理
SOD-523 为超小型 SMD 封装，便于自动贴片与回流焊工艺。由于封装体积小，器件的功耗（Pd 500 mW）在实际应用中需注意散热与降额设计：保持良好 PCB 铜箔散热、避免长时间高载流工作，并在布局时为热量扩散留出通道。
六、选型与使用建议
- 反向耐压 75 V，选型时应留有裕量以应对瞬态过压。
- 若电路存在较频繁或更高幅值的浪涌，应评估更高 Ifsm 能力的型号或并联保护元件。
- 在高频开关场合注意反向恢复造成的电压尖峰，必要时配合缓冲网络或 RC 吸收。
- 贴片工艺按厂商推荐的回流曲线执行，避免超温导致性能退化。
七、小结
LBAS516T1G 以其低 Vf、快速恢复与微型封装特点，适合对体积、电耗与切换速度有要求的电子产品中做小电流整流与开关保护。合理的热设计与适当的裕量选择可确保长期可靠运行。若需替代或并联使用，可参照同类快速恢复或肖特基二极管参数做对比选型。
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