WMSIC Electronic Components

LRC LMBR4020H3T5G

ModelLMBR4020H3T5G
PackageDFN-2(0.8x1.6)
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LMBR4020H3T5G
Type
LRC
Minimum package
10000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LMBR4020H3T5G
Electronic Component
1
Package
DFN-2(0.8x1.6)
Electronic Component
Schottky Diode
Electronic Component
0.012g
Electronic Component
1
Electronic Component
BM0228587516
Current
2A
Diode
1
Current(Ir)
50uA
(Vf)
560mV
Electronic Component
55℃~+125℃
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LMBR4020H3T5G 肖特基二极管产品概述

一、产品概述

LMBR4020H3T5G 是乐山无线电(LRC)推出的一款小尺寸、高效率肖特基整流二极管,封装为 DFN-2 (0.8 × 1.6 mm),面向空间受限的开关电源、负载保护与整流场合。器件工作结温范围为 -55℃ 至 +125℃,兼顾工业级温度稳定性与可靠性。

二、主要电气参数

  • 直流正向整流电流:2 A,满足中小功率整流需求;
  • 正向压降(Vf):典型 560 mV(在指定电流下),降低导通损耗,提升效率;
  • 非重复峰值浪涌电流(Ifsm):12 A,可承受短时启动或浪涌冲击;
  • 直流反向耐压(Vr):40 V,适用于 5V 至 24V 级别电源保护;
  • 反向电流(Ir):50 μA,低漏电流有助于降低静态损耗和提高待机效率。

三、器件特点与优势

  • 肖特基结构:低正向压降、快速恢复、适合高频开关场合;
  • 小型 DFN-2 封装:占板面积小,便于高密度布板与自动贴装;
  • 宽工作温度范围:适配工业与消费类环境,可靠性高;
  • 合理的浪涌能力与连续电流等级:满足常见电源启动和瞬态负载需求。

四、典型应用场景

  • 开关电源输出整流与续流二极管;
  • 低压降电源轨保护、反向电流隔离(例如电池反接保护、USB 电源路径控制);
  • DC-DC 转换器与降压模块的二次侧整流;
  • 功率管理与便携设备供电系统。

五、封装与热管理建议

DFN-2(0.8 × 1.6 mm)为热阻小、散热路径短的表贴封装。推荐注意事项:

  • 在 PCB 布局时为焊盘设计合适的热沉铜箔,结合多层过孔提高散热;
  • 保持焊盘过孔与周边铜箔的连通,以降低结-环境热阻;
  • 采用厂家推荐回流焊工艺曲线,避免因过热影响器件可靠性。

六、使用提示与可靠性

  • 在评估正向压降时,请参考具体测试电流与温度条件;实际电路中应留有余量以应对峰值浪涌;
  • 长期在高温、高电流工况下使用需注意热降额,确保结温不超过 +125℃;
  • 对于低漏电流要求极高的系统,建议在电路层面配合合适的分流或保护方案以控制静态功耗。

LMBR4020H3T5G 以其小体积、低压降和良好的热性能,适合对效率、板面空间和可靠性有要求的各类电源与保护应用。如需更多详细电气特性曲线、封装尺寸和焊接建议,请参阅厂商规格书或联系 LRC 技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.