WMSIC Electronic Components

LRC LBC847ALT1G

ModelLBC847ALT1G
PackageSOT-23
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LBC847ALT1G
Type
LRC
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LBC847ALT1G
Electronic Component
1
Package
SOT-23
Electronic Component
1 NPN
Electronic Component
Transistor(BJT)
Electronic Component
0.031g
Electronic Component
1
Electronic Component
BM0228587515
Operating Temperature
55℃~+150℃
Transistor Type
NPN
Frequency(f T)
100MHz
Power Dissipation(Pd)
300mW
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LBC847ALT1G 产品概述

一、产品简介

LBC847ALT1G 是乐山无线电(LRC)推出的一款小信号 NPN 双极型晶体管,采用 SOT-23 小封装设计,适用于低功耗开关和小信号放大场合。器件在低电流工作点下具有较高的直流电流增益,配合中等耐压与频率特性,可在便携式与空间受限的电路中发挥良好性能。

二、主要参数

  • 晶体管类型:NPN(BJT)
  • 集电极电流(Ic):100 mA(最大)
  • 集—射击穿电压(Vceo):45 V
  • 耗散功率(Pd):300 mW(封装及环境相关)
  • 直流电流增益(hFE):420 @ 2.0 mA,VCE=5.0 V(高增益特性)
  • 特征频率(fT):100 MHz(适合 VHF 及一般射频前端)
  • 集电极截止电流(Icbo):5 μA(低漏电流)
  • 集—射饱和电压(VCE(sat)):约 600 mV(饱和导通特性)
  • 射—基击穿电压(Vebo):6 V
  • 工作温度范围:-55 ℃ ~ +150 ℃
  • 封装:SOT-23(适合表面贴装)

三、关键特性与优势

  • 高直流电流增益:在低电流(≈2 mA)条件下 hFE 可达 420,利于高输入阻抗放大器和电流放大器设计,减少基极驱动功耗。
  • 中等耐压与电流能力:45 V 的 Vceo 与 100 mA 的最大 Ic 使其可胜任多数低功率开关与保护电路。
  • 良好的频率响应:fT ≈ 100 MHz,适用于音频至 VHF 频段的小信号放大与缓冲。
  • 低漏电流与宽工作温度:Icbo 典型小于 5 μA,配合 -55~+150 ℃ 的耐温性能,适合高可靠性与工业等级应用。

四、典型应用场景

  • 小信号放大器、前置放大及电平移位电路;
  • 低功耗开关驱动、逻辑接口缓冲;
  • 无线收发前端的低噪声放大与混频前置级(注意封装与布局对高频性能的影响);
  • 便携设备、传感器模块与电池供电系统中的通用晶体管替代件。

五、设计与使用建议

  • 热管理:SOT-23 封装的耗散功率有限(Pd≈300 mW),实际允许耗散受 PCB 键合铜箔面积与环境散热影响较大。高功率或连续导通场景应增大铜箔面积并考虑隔离热源。
  • 偏置与工作点:利用其高 hFE 可在较小基极电流下获得较大集电极电流,但在饱和开关时需注意 VCE(sat) 约 600 mV,若要求更低饱和压应采用专用低 VCE(sat) 器件或并联驱动方案(并联需均流措施)。
  • 高频布局:当用于接近 fT 的频率时,应缩短引线长度、优化地平面并增加旁路电容,减少封装与 PCB 寄生电容、感抗对增益与相位的影响。
  • 漏电与高阻节点:Icbo 较低,适合高阻输入或长时间偏置的场合,但在高温下漏电会增加,应在高温设计时留裕量。

六、封装与引脚

  • 封装形式:SOT-23,适合表面贴装与自动化贴装工艺;
  • 常见引脚标注(厂商数据表为准):SOT-23 的引脚排列在不同厂商可能有所差异,建议在设计 PCB 前参照 LRC 的原始数据手册确认基极、集电极、发射极的确切引脚号和引脚顺序。

七、可靠性与环境适应

  • 宽温工作范围与低漏电特性使该器件适合工业级与汽车电子中非关键主力功率环节的使用;
  • 在关键安全或高可靠性场合,建议参照厂商完整数据表与可靠性报告,必要时通过实际环境应力测试验证长期稳定性。

总结:LBC847ALT1G 是一款面向低功耗、小信号放大与通用开关场合的高增益 NPN 晶体管,SOT-23 封装与良好的频率特性使其在便携与空间受限系统中具有较高的性价比。选型时请结合实际工作电流、散热条件与频率需求,并以厂商数据手册为最终依据。

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