Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LRC LBAS20HT1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC LBAS20HT1G
- Type
- LRC
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LRC
- Electronic Component
- LBAS20HT1G
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Switch Diode
- Electronic Component
- 0.028g
- Electronic Component
- 1
- Electronic Component
- BM0227740778
- Current
- 200mA
- Diode
- Electronic Component
- Current(Ir)
- 1uA
- (Vf)
- 1V
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 55℃~+150℃@(Tj)
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LBAS20HT1G 产品概述
1. 产品简介
LBAS20HT1G 是一款由乐山无线电（LRC）生产的高性能开关二极管，采用独立式配置，封装形式为 SOD-323。该二极管具有快速反向恢复时间、低反向电流和高直流反向耐压等特点，适用于各种高频开关和整流应用。
2. 主要特性
反向恢复时间 (trr): 50ns
- 快速的反向恢复时间使得 LBAS20HT1G 在高频开关应用中表现出色，能够有效减少开关损耗，提高系统效率。
反向电流 (Ir): 1uA
- 极低的反向电流确保了二极管在反向偏置时的低功耗，适用于对功耗敏感的应用场景。
整流电流: 200mA
- 能够处理高达 200mA 的整流电流，适用于中小功率的整流和开关应用。
正向压降 (Vf): 1V
- 较低的正向压降减少了导通时的功率损耗，提高了整体效率。
直流反向耐压 (Vr): 200V
- 高直流反向耐压使得 LBAS20HT1G 能够在高压环境下稳定工作，适用于多种高压应用。
工作温度范围: -55℃ ~ 150℃ (Tj)
- 宽广的工作温度范围确保了二极管在极端环境下的可靠性和稳定性。
3. 应用领域
LBAS20HT1G 由于其优异的性能参数，广泛应用于以下领域：
- 高频开关电路: 由于其快速的反向恢复时间，LBAS20HT1G 非常适合用于高频开关电路，如开关电源、DC-DC 转换器等。
- 整流电路: 200mA 的整流电流和 200V 的直流反向耐压使其适用于中小功率的整流应用，如电源适配器、充电器等。
- 信号处理: 在信号处理电路中，LBAS20HT1G 可以用于信号整形、限幅等应用。
- 工业控制: 在工业控制系统中，LBAS20HT1G 可以用于各种开关和整流应用，确保系统的稳定性和可靠性。
4. 封装与尺寸
LBAS20HT1G 采用 SOD-323 封装，尺寸小巧，便于在紧凑的电路板上进行布局和焊接。SOD-323 封装具有良好的热性能和电气性能，适合高密度安装。
5. 品牌与质量保证
LBAS20HT1G 由乐山无线电（LRC）生产，LRC 是一家在电子元器件领域具有多年经验的专业制造商，其产品以高质量和可靠性著称。LBAS20HT1G 经过严格的质量控制和测试，确保其在各种应用场景下的稳定性和长寿命。
6. 总结
LBAS20HT1G 是一款高性能的开关二极管，具有快速反向恢复时间、低反向电流、高直流反向耐压和宽广的工作温度范围等特点。其适用于高频开关、整流、信号处理和工业控制等多种应用领域。采用 SOD-323 封装，尺寸小巧，便于高密度安装。由乐山无线电（LRC）生产，质量可靠，是各种电子设备中的理想选择。
通过以上概述，可以看出 LBAS20HT1G 在电子元器件市场中具有广泛的应用前景和良好的性能表现，能够满足多种复杂电路设计的需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
