WMSIC Electronic Components

LRC LESD8D3.3CBT5G

ModelLESD8D3.3CBT5G
PackageSOD-882
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LESD8D3.3CBT5G
Type
LRC
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LESD8D3.3CBT5G
Electronic Component
1
Package
SOD-882
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.009g
Electronic Component
1
Cj- Capacitor
20pF
Electronic Component
BM0227739076
Operating Temperature
55℃~+150℃
Voltage
9V
Electronic Component
IEC 61000-4-4;IEC 61000-4-2
Current(Ir)
50nA
Voltage(VBR)
6.5V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LESD8D3.3CBT5G 产品概述

一、产品简介

LESD8D3.3CBT5G 是乐山无线电(LRC)推出的一款用于接口静电与瞬态脉冲保护的ESD二极管。器件采用紧凑的SOD-882封装,针对工作电压为3.3V的系统而优化,能够在瞬态脉冲发生时迅速吸收能量,保护下游敏感电路不受破坏。产品满足IEC 61000-4-2(静电放电)与IEC 61000-4-4(电快速瞬变)防护要求,适合各种消费电子与工业应用。

二、主要参数

  • 反向截止电压(Vrwm):3.3V
  • 击穿电压(Vbr):约6.5V
  • 钳位电压(Vclamp):约9V(在峰值脉冲条件下)
  • 峰值脉冲电流(Ipp):10A @ 8/20µs
  • 峰值脉冲功率(Ppp):105W @ 8/20µs
  • 反向电流(Ir):50nA
  • 结电容(Cj):约20pF
  • 工作温度范围:-55℃ ~ +150℃
  • 封装:SOD-882
  • 防护等级:符合 IEC 61000-4-2 / IEC 61000-4-4

三、产品特点与优势

  • 专为3.3V系统设计,反向截止电压匹配常见微控制器与数字接口。
  • 在8/20µs标准脉冲下具备10A吸收能力和105W脉冲功率,能有效应对绝大多数静电和浪涌事件。
  • 钳位电压约9V,可在短时高电压冲击时限制线路电压,减少下游器件承受过压。
  • 低反向漏电(50nA)与较低结电容(20pF),对高速信号影响小,适合高速数据线保护。
  • 小型SOD-882封装,便于在空间受限的设计中近端布局,实现更高的保护效率。

四、典型应用场景

  • 3.3V数字接口保护(GPIO、I2C、SPI、UART 等)
  • 通信接口与数据线(例如以太网、串口、USB 前端保护)
  • 无线模块与射频前端的保护(需注意结电容对高频的影响)
  • 工业控制设备、仪表及人机界面(HMI)等易受静电或快速瞬变干扰的场合

五、封装与PCB布局建议

  • 将器件尽量靠近受保护的输入/连接器放置,缩短信号到器件的走线长度以提高保护性能。
  • 为良好接地回路,建议在器件附近布置多点接地或接地平面,并在必要处使用多孔过孔(vias)将保护地快速接至参考地层。
  • 对于高速差分信号,注意器件的结电容对阻抗的影响,必要时评估并选用更低电容的保护方案。
  • 推荐遵循制造商的回流焊工艺规范进行焊接,避免过热和机械应力,确保长期可靠性。

六、可靠性与使用注意

  • 器件额定工作温度范围为-55℃至+150℃,可满足严苛环境下的长期工作需求。
  • 在选型时应确认钳位电压、吸收能力与所需保护等级匹配,避免在超出规格的冲击下使用。
  • 量产装配与测试过程中应遵守ESD防护措施,避免在非受控环境下损伤元件。
  • 如需在双向信号或交流线路上使用,请核实器件单向/双向特性,以免造成误用。

七、结语与选型建议

LESD8D3.3CBT5G 以其匹配3.3V系统的参数、较高的脉冲吸收能力和低漏电、低电容特性,适合多数需在近端实现快速ESD/浪涌保护的设计场景。具体电气测试曲线、封装尺寸及选型细节建议参考厂家完整数据手册或向乐山无线电代理商索取样品验证,以确保与目标系统的兼容性与可靠性。若需帮助评估保护方案或PCB布局建议,可提供电路原理图与接口信息进行进一步分析。

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