Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
LRC LP137N3T5G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC LP137N3T5G
- Type
- LRC
- Minimum package
- 10000
Technical parameters
- Electronic Component
- LRC
- Electronic Component
- LP137N3T5G
- Electronic Component
- 1
- Package
- SOT-883
- Electronic Component
- 1 P
- Type
- P
- Electronic Component
- MOSFET
- Electronic Component
- 0.009g
- Electronic Component
- 1
- Electronic Component
- BM0264780218
- Operating Temperature
- 55℃~+150℃
- Power Dissipation(Pd)
- 400mW
- Electronic Component
- 10000
- Voltage(Vdss)
- 20V
- Capacitor(Ciss)
- 54pF
- Gate (Qg)
- [email protected]
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LP137N3T5G 产品概述
一、产品定位与概览
LP137N3T5G 是乐山无线电（LRC）推出的一款小功率 P 沟道场效应管（P‑MOSFET），采用紧凑的 SOT‑883 封装，面向便携式电源路径控制与小电流高侧开关场景。器件在低门压下即可导通，栅极电荷小，适合对体积和驱动能耗敏感的应用。
二、主要参数（典型/额定）
- 类型：P‑沟道 MOSFET（单只）
- 漏源耐压 Vdss：20 V
- 连续漏极电流 Id：3.6 A（器件额定）
- 导通电阻 RDS(on)：约 890 mΩ @ Vgs = 1.8 V
- 功耗 Pd：400 mW（封装限值）
- 阈值电压 Vgs(th)：约 1.0 V（Ig = 250 μA 条件）
- 栅极电荷 Qg：约 1.4 nC @ Vgs = 4.5 V
- 输入电容 Ciss：约 54 pF
- 工作结温：-55 ℃ ~ +150 ℃
- 封装：SOT‑883（超小型封装）
三、特色与应用场景
- 低阈值（≈1 V），在低电压系统中可较早进入导通，适合电池供电设备的高侧开关与电源管理。
- Qg 与 Ciss 较小，开关损耗低，适合需要频繁切换或对门极驱动能耗有限制的电路。
- 适用场景示例：移动设备电源路径切换、背光/指示灯小电流开关、反接保护与瞬态限流、物联网终端、便携式测量仪表等。
四、使用建议与注意事项
- 虽然器件标称 Id 可达 3.6 A，但 SOT‑883 封装的热阻和 Pd=400 mW 限制了实际长期导通电流。推荐在实际 PCB 散热条件下验证，若持续电流接近或超过 0.5–1 A 需慎重评估发热与封装温升。描述中出现的“900 mA”等级别在良好散热与短时工作下可行，但不代表无限制长期工作能力。
- 为获得较低的 RDS(on)，建议门极驱动尽量接近 1.8–4.5 V 范围；在更低门压下导通电阻会明显增大。
- 在设计驱动电路时注意栅极电荷 Qg（1.4 nC）与驱动能力匹配，以避免开关瞬态过慢带来额外损耗或热量。
- 使用前请参考完整数据手册，核对封装引脚定义与最大额定值（尤其是 VGS 最大允许值、浪涌电流和安全工作区）。
五、封装与热管理
SOT‑883 为超小型封装，便于高密度 PCB 布局，但散热能力有限。建议通过加大 PCB 铜箔面积、使用热通孔或将器件靠近散热面布置来改善热传导。在高环境温度或连续较大负载情况下，应进行温升仿真或实测，确保结温不超过额定上限。
六、总结
LP137N3T5G 以其低阈值、低栅极电荷和小输入电容的组合，适合低电压、低到中等电流的高侧开关与电源管理场合。设计时应重点关注封装的热限制和实际工作电流，合理选择门极驱动电压与 PCB 散热方案，方能发挥该器件在体积受限系统中的优势。欲获得更详细的时序、绝对最大额定值与典型特性曲线，请参阅厂商完整数据手册或联系 LRC 技术支持。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
