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LRC LBAT54BST5G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC LBAT54BST5G
- Type
- LRC
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- LRC
- Electronic Component
- LBAT54BST5G
- Electronic Component
- 1
- Package
- SOD-882
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.018g
- Electronic Component
- 1
- Electronic Component
- BM0230657030
- Current
- 200mA
- Diode
- 1
- Current(Ir)
- 2uA
- (Vf)
- 240mV
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
- Voltage Rating(Vr)
- 30V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
LBAT54BST5G 产品概述
一、产品简介
LBAT54BST5G 是乐山无线电（LRC）出品的一款肖特基势垒二极管（Schottky diode），采用小型 SOD-882 封装，适用于空间受限的表面贴装电路。该器件以低正向压降和低反向漏电为主要特点，适合用于高效率整流、保护与高频开关场合。
二、主要电气参数
- 正向压降 (Vf)：240 mV（标称）
- 直流反向耐压 (Vr)：30 V
- 正向整流电流：200 mA（连续）
- 反向电流 (Ir)：2 μA（标称）
- 非重复峰值浪涌电流 (Ifsm)：600 mA
以上参数为典型/标称值，具体测试条件（如测量电流、温度等）请参照厂商详细数据手册。
三、关键特性与优势
- 低正向压降（≈240 mV）：在低电压差应用中可显著降低功耗与发热，提高效率。
- 低反向漏电（≈2 μA）：在待机或高阻抗电路中可降低泄漏损耗，提升静态性能。
- 良好的浪涌承受能力（Ifsm 600 mA）：满足瞬态电流冲击场景的要求。
- 小尺寸 SOD-882 封装：适合便携设备与高密度 PCB 布局，利于体积和重量优化。
四、典型应用场景
- 低压整流与同步整流电路（如手机充电、便携式电源）
- 电源反接保护与极性保护（输入侧保护二极管）
- 开关电源与 DC-DC 转换器的快速恢复或二次整流
- 信号链的钳位、限幅与低电压检测电路
五、封装与可靠性建议
SOD-882 为极小型表贴封装，焊接时应注意回流曲线和焊盘设计，以保证良好的焊接可靠性与热散逸。布局时建议：
- 走线尽量短且宽，以减小串联电阻与热阻。
- 若用于较大电流场合，考虑加铜厚或局部散热铜箔。
- 若电路对漏电极为敏感，应在布局与防护层面避免高温和强电场影响。
六、选型与使用注意事项
- 请根据具体工况核对 Vf 的测试电流与温度依赖，避免仅凭标称值做最终热耗和效率计算。
- 反向耐压 30 V 适用于大多数低压系统，但在有高压尖峰或浪涌的环境应加抑制元件或选择更高 Vr 等级。
- 若应用需要更高连续电流或更低正向压降，请参考更高规格的肖特基型号或并联使用（并联时注意电流均分）。
- 阅读并遵循 LRC 官方数据手册中的绝对最大额定值、热阻和封装尺寸信息以确保可靠性。
七、总结
LBAT54BST5G 以其低 Vf、低 Ir 与小型封装，适合用于便携电源、保护与高频开关应用，能在有限空间内提供良好的能效与可靠性。最终选型建议结合实际工作电流、浪涌要求与热管理方案，并参照厂商完整 Datasheet 以获得精确的参数与应用指导。
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