WMSIC Electronic Components

LRC LESD8L3.3CT5G

ModelLESD8L3.3CT5G
PackageSOD-882
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LESD8L3.3CT5G
Type
LRC
Minimum package
10000 个

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LESD8L3.3CT5G
Electronic Component
1
Package
SOD-882
Electronic Component
Electronic Component
Type
ESD
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.009g
Electronic Component
1
Cj- Capacitor
0.5pF
Electronic Component
BM0230024593
Voltage
10V
Electronic Component
IEC 61000-4-2
Current(Ir)
1uA
Voltage(VBR)
4.8V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LESD8L3.3CT5G 产品概述

一、产品简介

LESD8L3.3CT5G 是乐山无线电(LRC)推出的一款双向ESD保护二极管,针对低压高速信号线的静电与浪涌保护设计。器件响应快、结电容小,适合用于USB、HDMI、手持终端、传感器接口及高密度板载接口的瞬态过压保护。

二、主要电气参数

  • 极性:双向(双向对称保护)
  • 额定反向工作电压 VRWM:标称 3.3V(资料中典型值 3.5V)
  • 击穿电压 VBR:4.8V
  • 钳位电压 Vc:约 10V(视冲击电流而定)
  • 反向漏电流 IR:典型 0.05 μA,最大可达 1 μA(随温度与电压变化)
  • 结电容 Cj:约 0.5 pF(低电容,利于高速信号完整性)
  • 防护等级:符合 IEC 61000-4-2 静电放电标准
  • 封装:SOD-882(小型化,适合高密度布局)

三、结构与封装特点

SOD-882 封装尺寸小,适用于贴片焊接与自动化生产。双向设计内部为对称结构,无需外接偏置即可实现正负极性的瞬态钳位,对差分线与双向传输线尤为合适。低结电容保证对高频信号的影响最小。

四、性能要点与典型应用

  • 快速响应:可在纳秒级响应ESD脉冲,吸收高能量瞬态,保护后端敏感器件。
  • 低漏电:IR 非常小,适合电池供电与待机功耗敏感的设备。
  • 低电容:0.5 pF 有利于维持高速数据线(如 USB/PCIe/HDMI)的信号完整性。
    适用场景包括:移动终端外壳接口、数据通信端口、CMOS传感器接口、车载信息娱乐系统及工业控制信号线保护。

五、选型与电路设计建议

  • 若系统直流工作电压接近 3.3V,应确认 VRWM(3.3V/3.5V)与系统裕量,避免器件在正常工作时进入击穿区域。
  • 评估钳位电压与被保护器件承受能力,10V 为典型钳位参考,实际钳位与冲击电流相关,需根据浪涌电流规格核算。
  • 布局建议:保护二极管应尽可能靠近受保护端口放置,走线短且粗,避免回路面积增大。对差分信号,采用对称布局并保持器件与线对之间阻抗连续性。
  • 熔断与热管理:SOD-882 为塑封小型器件,长时间高能量冲击可能导致热应力,必要时考虑并联或级联保护方案。

六、可靠性与焊接注意

  • 推荐回流焊工艺参数遵循 LRC 封装规范,避免超温或长时高温导致封装变形。
  • 储存与湿敏等级按厂商说明处理,防潮防静电包装有利于提高良率。
  • 对于关键应用建议做系统级 ESD 测试,验证在 IEC 61000-4-2 条件下的真实表现。

七、小结

LESD8L3.3CT5G 凭借双向保护、低结电容与低漏电流特性,适合对高速、低电压信号线进行有效的瞬态浪涌与静电保护。在选型时关注 VRWM 与系统工作电压的匹配、钳位能力与布局布线细节,可在保证信号完整性的同时显著提升系统可靠性。

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