WMSIC Electronic Components

LRC LBSS260DW1T1G

ModelLBSS260DW1T1G
PackageSOT-363
BrandLRC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
LRC LBSS260DW1T1G
Type
LRC
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
LRC
Electronic Component
LBSS260DW1T1G
Electronic Component
1
Package
SOT-363
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
0.013g
Electronic Component
1
Electronic Component
BM0226545622
Operating Temperature
55℃~+150℃
Power Dissipation(Pd)
380mW
Electronic Component
Electronic Component
Electronic Component
3000
Voltage(Vdss)
60V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

LBSS260DW1T1G 产品概述

一、产品简介

LBSS260DW1T1G(品牌:LRC/乐山无线电)是一款小封装单通道N沟道场效应管(MOSFET),封装为SOT-363。器件额定漏源耐压为60V,适用于低功耗、开关及信号传输类应用场景。工作温度范围宽,-55℃至+150℃,适合工业级温度要求的设计。

二、主要参数

  • 类型:N沟道 MOSFET(单通道)
  • 漏源电压 Vdss:60V
  • 阈值电压 Vgs(th):1.0V(Id=250µA)
  • 导通电阻 RDS(on):2.5Ω @ Vgs=2.5V
  • 连续漏极电流 Id:200mA
  • 功耗 Pd:380mW
  • 输入电容 Ciss:22.8pF @ 25V
  • 反向传输电容 Crss:2.9pF @ 25V
  • 封装:SOT-363
  • 数量:1个N沟道

三、性能亮点

  • 小体积封装(SOT-363)便于高密度贴片和便携设备设计;
  • 低至1V的阈值电压,便于在低电压逻辑下被驱动;
  • 在2.5V栅压下的导通电阻为2.5Ω,适合微小功率负载开关;
  • 较低的输入电容(Ciss≈22.8pF),有利于快速开关且占用较少驱动能量;
  • 宽温度范围和合理功耗能力(Pd=380mW)适用于一般工业环境。

四、典型应用

  • 便携式设备的电源/负载切换与控制;
  • 低电流开关、信号路由与模拟开关场合;
  • 电平位移、逻辑隔离及保护电路(反向保护、低功耗开断);
  • 小功率驱动电路、传感器接口与电子玩具等。

五、使用建议与注意事项

  • 由于RDS(on)在2.5V栅压下为2.5Ω,器件适用于小于数百毫安的负载;超过时请评估功耗和温升;Pd=380mW需注意PCB散热与铜箔面积;
  • 驱动方式:若需更低RDS(on),应提高Vgs(但请参考器件最大栅压规范),否则在低电压下仍以开关/信号用途为主;
  • 开关速度与栅容:Ciss和Crss会影响切换损耗与驱动需求,驱动器需能提供足够电流以快速充放电栅电容,避免长时间处于线性区发热;
  • 焊接与处理:SOT-363为小型封装,建议采用回流焊工艺并注意防静电措施。

六、选型参考

若设计需要在60V耐压下进行小电流开关、要求小封装与低输入电容,LBSS260DW1T1G是合适的选择。对于更高电流或更低导通电阻的需求,应选择更大封装或低RDS(on)等级的MOSFET。

七、结语

LBSS260DW1T1G以其紧凑封装、合适的耐压等级和低电容特性,适合各种低功耗、小电流的开关与信号应用。设计时关注导通损耗与散热布局,可发挥其在便携与工业场景中的优势。

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