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LRC S-LBAS21HT1G
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- LRC S-LBAS21HT1G
- Type
- LRC
- Minimum package
- 3000
Technical parameters
- Electronic Component
- LRC
- Electronic Component
- S-LBAS21HT1G
- Electronic Component
- 1
- Package
- SOD-323
- Electronic Component
- Switch Diode
- Electronic Component
- 0.026g
- Electronic Component
- 1
- Electronic Component
- BM0230027924
- Current
- 200mA
- Diode
- Electronic Component
- Current(Ir)
- 100nA@200V
- (Vf)
- 1.25V@200mA
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 55℃~+150℃@(Tj)
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 250V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
S-LBAS21HT1G 产品概述
一、概述
S-LBAS21HT1G 为 LRC（乐山无线电）推出的一款独立式开关/整流二极管，采用 SOD-323 小封装，专为小电流高速切换和高压环境设计。器件在 200mA 工作电流下具有较低的正向压降（Vf），并具备快速恢复特性，适用于空间受限且需高频率开关的电路。
二、主要参数
- 二极管配置：独立式
- 正向压降：1.25V @ 200mA
- 直流反向耐压（Vr）：250V
- 整流电流（Io）：200mA
- 功耗耗散（Pd）：200mW
- 反向电流（Ir）：100nA @ 200V
- 反向恢复时间（Trr）：50ns
- 非重复峰值浪涌电流（Ifsm）：9A（单次浪涌）
- 工作结温范围（Tj）：-55℃ ~ +150℃
- 封装：SOD-323
三、特性优势
- 低正向压降（1.25V@200mA），在小电流整流场合可降低功率损耗。
- 高耐压（250V），适合高压侧的保护与整流用途。
- 极小的反向漏流（100nA@200V），适合要求高阻态稳定性的电路。
- 快速恢复（Trr=50ns），适于高速开关、PWM 与开关电源的回路整流。
- SOD-323 封装体积小，便于高密度贴片装配。
四、典型应用
- 小功率开关电源及辅助电路整流
- 高频信号开关与保护电路
- 反向极性保护、钳位与钳位二极管
- 显示驱动、通信设备及消费类电子的低电流整流
五、封装与热管理
SOD-323 小封装热阻较大，额定耗散功率为 200mW，在实际设计中应注意结到环境的热阻和 PCB 散热路径。连续工作电流建议不超过额定 200mA，若在较高环境温度或密集布板场合，应对功率做降额处理。
六、注意事项与可靠性
- 避免在超过 Vr=250V 条件下长期施加反向电压。
- 谨慎处理峰值浪涌，Ifsm=9A 为非重复峰值；重复冲击可影响寿命。
- 推荐遵循厂家回流焊温度曲线，避免超温造成封装或焊点损伤。
- 工作结温不超过 +150℃，长期高温会加剧漏电及寿命衰减。
七、使用建议
- 在 PCB 布局中，尽量缩短二极管与开关器件之间的环路，减小寄生电感。
- 对于高频整流，考虑并联或选用更高 Pd 的器件以减轻发热。
- 在敏感模拟或高阻输入处使用时，注意反向漏电对电路偏置的影响。
S-LBAS21HT1G 以其低 Vf、高 Vr 和快速恢复性能，适合对体积、速度和高压兼容性有要求的小功率设计场景。
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